Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466550 | Semiconductor structure and a method of manufacturing a semiconductor structure | Navas Khan Oratti Kalandar, Xiaowu Zhang, Chee Houe Khong | 2013-06-18 |
| 7592703 | RF and MMIC stackable micro-modules | Mihai Rotaru, Ganesh Vetrivel Periasamy, Seung Uk Yoon, Ranganathan Nagarajan | 2009-09-22 |
| 7230318 | RF and MMIC stackable micro-modules | Mihai Rotaru, Ganesh Vetrivel Periasamy, Seung Uk Yoon, Ranganathan Nagarajan | 2007-06-12 |
| 7189594 | Wafer level packages and methods of fabrication | Wai Kwan Wong, Mihai Rotaru, Tai Chong Chai, Mahadevan Iyer | 2007-03-13 |
| 7160756 | Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices | Seung Wook Yoon, Ganesh Vetrivel Periasamy | 2007-01-09 |
| 7141487 | Method for ultra thinning bumped wafers for flip chip | Ganesh Vetrivel Periasamy | 2006-11-28 |
| 6872464 | Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent | Holger Hubner | 2005-03-29 |
| 6846725 | Wafer-level package for micro-electro-mechanical systems | Ranganathan Nagarajan, Chirayarikathuveedu Sankarapillai Premachandran, Yu-Chiao Chen | 2005-01-25 |
| 6787456 | Wafer-level inter-connector formation method | Mahadevan Iyer, Ranganathan Nagarajan | 2004-09-07 |
| 6773956 | Method for contact-connecting a semiconductor component | Holger Huebner | 2004-08-10 |
| 6717812 | Apparatus and method for fluid-based cooling of heat-generating devices | Damaruganath Pinjala, Hengyun Zhang, Mahadevan Iyer, Ranganathan Nagarajan | 2004-04-06 |