Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977758 | Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures | Markondeya Raj Pulugurtha, Madhaven Swaminathan, Rao R. Tummala, Isaac Abothu, Jin Hyun Hwang | 2011-07-12 |
| 7189594 | Wafer level packages and methods of fabrication | Vaidyanathan Kripesh, Wai Kwan Wong, Mihai Rotaru, Tai Chong Chai | 2007-03-13 |
| 7178711 | Method and device to elongate a solder joint | Ee Hua Wong, Ranjan Rajoo, Wai Kwan Wong | 2007-02-20 |
| 6879287 | Packaged integrated antenna for circular and linear polarizations | Alexander Pavlovich Popov, Mihai Rotaru | 2005-04-12 |
| 6787456 | Wafer-level inter-connector formation method | Vaidyanathan Kripesh, Ranganathan Nagarajan | 2004-09-07 |
| 6717812 | Apparatus and method for fluid-based cooling of heat-generating devices | Damaruganath Pinjala, Vaidyanathan Kripesh, Hengyun Zhang, Ranganathan Nagarajan | 2004-04-06 |
| 6710438 | Enhanced chip scale package for wire bond dies | Yong Kee Yeo, Navas O.K. Khan | 2004-03-23 |
| 6617667 | Optical device carrier | Mui Seng Yeo, Yong Kee Yeo, Eitaro Ishimura, Gou Sakaino | 2003-09-09 |
| 6608379 | Enhanced chip scale package for flip chips | Yong Kee Yeo, Damaruganath Pinjala | 2003-08-19 |
| 6599138 | High frequency board-to-board connector | Yong Kee Yeo, Edwin Lim, Ke Hor Seah, Weng Chiok Thong | 2003-07-29 |