Navas O.K. Khan

AP Advanced Microdevices Pvt: 1 patents #2 of 26Top 8%

AT Amkor Technology: 1 patents #386 of 595Top 65%

IM Institute Of Microelectronics: 1 patents #60 of 153Top 40%

SP St Assembly Test Services Pte: 1 patents #25 of 50Top 50%

📍 Singapore, SG: #6,661 of 13,971 inventorsTop 50%

Overall (All Time): #3,473,917 of 4,157,543Top 85%

Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
6710438	Enhanced chip scale package for wire bond dies	Yong Kee Yeo, Mahadevan Iyer	2004-03-23