Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6710438 | Enhanced chip scale package for wire bond dies | Navas O.K. Khan, Mahadevan Iyer | 2004-03-23 |
| 6617667 | Optical device carrier | Mui Seng Yeo, Mahadevan Iyer, Eitaro Ishimura, Gou Sakaino | 2003-09-09 |
| 6608379 | Enhanced chip scale package for flip chips | Damaruganath Pinjala, Mahadevan Iyer | 2003-08-19 |
| 6599138 | High frequency board-to-board connector | Mahadevan Iyer, Edwin Lim, Ke Hor Seah, Weng Chiok Thong | 2003-07-29 |