DP

Damaruganath Pinjala

CI Cisco: 8 patents #1,756 of 13,007Top 15%
IM Institute Of Microelectronics: 1 patents #60 of 153Top 40%
Overall (All Time): #442,903 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12137530 Method and apparatus for maintaining cooling of modular electronic system during module removal Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Jatin Kohli, Robert Gregory Twiss 2024-11-05
11980005 Corrosion preventive heatsink for network device Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara 2024-05-07
11644500 Adjustable anchor for printed circuit board environmental sensor Mohammed Ghouse, Shailesh R. Nayak, Rohit Dev Gupta, Mehmet Onder Cap 2023-05-09
11255897 Adjustable anchor for printed circuit board environmental sensor Mohammed Ghouse, Shailesh R. Nayak, Rohit Dev Gupta, Mehmet Onder Cap 2022-02-22
11234342 Corrosion preventive heatsink for network device Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara 2022-01-25
11172587 Method and apparatus for maintaining cooling of modular electronic system during module removal Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Jatin Kohli, Robert Gregory Twiss 2021-11-09
10690868 Thermal protection for modular components in a network device Joel Richard Goergen, Mehmet Onder Cap, Arjun Jayaprakash, Marc Mantelli, Umeshbabu NANDANAN +2 more 2020-06-23
10631424 Method and apparatus for maintaining cooling of modular electronic system during module removal Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Jatin Kohli, Robert Gregory Twiss 2020-04-21
6873527 Heat transfer apparatus Heng Yun Zhang, Hidetaka Hayashi, Poh Keong Chan 2005-03-29
6717812 Apparatus and method for fluid-based cooling of heat-generating devices Vaidyanathan Kripesh, Hengyun Zhang, Mahadevan Iyer, Ranganathan Nagarajan 2004-04-06
6608379 Enhanced chip scale package for flip chips Yong Kee Yeo, Mahadevan Iyer 2003-08-19