Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11767217 | MEMS devices and methods of forming thereof | Jia Jie Xia, Rakesh Kumar, Bevita Kallupalathinkal Chandran | 2023-09-26 |
| 11631800 | Piezoelectric MEMS devices and methods of forming thereof | Jia Jie Xia, Bevita Kallupalathinkal Chandran, Miles Jacob Gehm | 2023-04-18 |
| 11267696 | MEMS devices and methods of forming thereof | Jia Jie Xia, Rakesh Kumar, Bevita Kallupalathinkal Chandran | 2022-03-08 |
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Vivek Chidambaram, Ling Xie, Bangtao Chen, Beng Yeung Ho | 2016-01-19 |
| 7682914 | Fully salicided (FUCA) MOSFET structure | Patrick Guo-Qiang Lo, Wei-Yip Loh, Narayanan Balasubramanian | 2010-03-23 |
| 7592703 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Ganesh Vetrivel Periasamy, Seung Uk Yoon | 2009-09-22 |
| 7381629 | Method of forming through-wafer interconnects for vertical wafer level packaging | Chirayarikathuveedu Premachandran Sankarapillai, Mohanraj Soundarapandian | 2008-06-03 |
| 7326629 | Method of stacking thin substrates by transfer bonding | Chirayarikathuveedu Premachandran Sankarapillai | 2008-02-05 |
| 7294890 | Fully salicided (FUSA) MOSFET structure | Patrick Guo-Qiang Lo, Wei-Yip Loh, Narayanan Balasubramanian | 2007-11-13 |
| 7230318 | RF and MMIC stackable micro-modules | Vaidyanathan Kripesh, Mihai Rotaru, Ganesh Vetrivel Periasamy, Seung Uk Yoon | 2007-06-12 |
| 7183176 | Method of forming through-wafer interconnects for vertical wafer level packaging | Chirayarikathuveedu Premachandran Sankarapillai, Mohanraj Soundarapandian | 2007-02-27 |
| 6858459 | Method of fabricating micro-mirror switching device | Janak Singh, Uppili Sridhar, Quanbo Zou | 2005-02-22 |
| 6846725 | Wafer-level package for micro-electro-mechanical systems | Chirayarikathuveedu Sankarapillai Premachandran, Yu-Chiao Chen, Vaidyanathan Kripesh | 2005-01-25 |
| 6787456 | Wafer-level inter-connector formation method | Vaidyanathan Kripesh, Mahadevan Iyer | 2004-09-07 |
| 6717812 | Apparatus and method for fluid-based cooling of heat-generating devices | Damaruganath Pinjala, Vaidyanathan Kripesh, Hengyun Zhang, Mahadevan Iyer | 2004-04-06 |
| 6716570 | Low temperature resist trimming process | Shajan Mathew, Lakshmi Kanta Bera | 2004-04-06 |
| 6662654 | Z-axis accelerometer | Yubo Miao, Uppili Sridhar, Rakesh Kumar, Qinxin Zhang | 2003-12-16 |
| 6571628 | Z-axis accelerometer | Yubo Miao, Uppili Sridhar, Rakesh Kumar, Zhang Qingxin | 2003-06-03 |
| 6573154 | High aspect ratio trench isolation process for surface micromachined sensors and actuators | Uppili Sridhar, Yu Miao, Yi-Nan Su | 2003-06-03 |
| 6551937 | Process for device using partial SOI | Cai Jun, Ren Chang Hong, Narayanan Balasubramanian, Yung Chii Liang | 2003-04-22 |
| 6461888 | Lateral polysilicon beam process | Uppili Sridhar, Yubo Miao | 2002-10-08 |