Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1040992 | Stove exhaust system | Jalaja V. Uppili, Sudarsan Uppili | 2024-09-03 |
| 10475559 | Controlling the morphology in metal loaded paste material | Nazanin Davani, Joseph P. Ellul | 2019-11-12 |
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Amit S. Kelkar, Xuejun Ying | 2016-05-03 |
| 9184113 | Methods of forming coaxial feedthroughs for 3D integrated circuits | Albert Bergemont | 2015-11-10 |
| 9023422 | High rate deposition method of magnetic nanocomposites | Joseph P. Ellul | 2015-05-05 |
| 8970043 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Amit S. Kelkar, Xuejun Ying | 2015-03-03 |
| 8952768 | Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters | Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall | 2015-02-10 |
| 8940631 | Methods of forming coaxial feedthroughs for 3D integrated circuits | Albert Bergemont | 2015-01-27 |
| 8686543 | 3D chip package with shielded structures | Albert Bergemont, Joseph P. Ellul, Yi-Sheng Anthony Sun, Elliott Simons | 2014-04-01 |
| 8512800 | Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters | Edward Martin Godshalk, Rick D. Lutz, Masud Hannan, Ralph N. Wall | 2013-08-20 |
| 7863699 | Bonded wafer package module | Hans Dropmann, Carlton Stuebing | 2011-01-04 |
| 7463125 | Microrelays and microrelay fabrication and operating methods | Quanbo Zou | 2008-12-09 |
| 7393758 | Wafer level packaging process | Quanbo Zou | 2008-07-01 |
| 6908825 | Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loop | Shuming Xu, Hanhua Feng, Pang Dow Foo, Bai Xu | 2005-06-21 |
| 6858459 | Method of fabricating micro-mirror switching device | Janak Singh, Ranganathan Nagarajan, Quanbo Zou | 2005-02-22 |
| 6841839 | Microrelays and microrelay fabrication and operating methods | Quanbo Zou | 2005-01-11 |
| 6765300 | Micro-relay | Dirk Wagenaar, Kay Krupka, Helmut Schlaak, Victor Donald Samper, Pang Dow Foo | 2004-07-20 |
| 6762049 | Miniaturized multi-chamber thermal cycler for independent thermal multiplexing | Quanbo Zou | 2004-07-13 |
| 6662654 | Z-axis accelerometer | Yubo Miao, Ranganathan Nagarajan, Rakesh Kumar, Qinxin Zhang | 2003-12-16 |
| 6621135 | Microrelays and microrelay fabrication and operating methods | Quanbo Zou | 2003-09-16 |
| 6571628 | Z-axis accelerometer | Yubo Miao, Ranganathan Nagarajan, Rakesh Kumar, Zhang Qingxin | 2003-06-03 |
| 6573154 | High aspect ratio trench isolation process for surface micromachined sensors and actuators | Ranganathan Nagarajan, Yu Miao, Yi-Nan Su | 2003-06-03 |
| 6521447 | Miniaturized thermal cycler | Quanbo Zou, Yu Chen, Tit Meng Lim, Emmanuel Selvanayagam Zachariah, Tie Yan | 2003-02-18 |
| 6509186 | Miniaturized thermal cycler | Quanbo Zou, Yu Chen, Tit Meng Lim, Emmanuel Selvanayagam Zachariah, Tie Yan | 2003-01-21 |
| 6503847 | Room temperature wafer-to-wafer bonding by polydimethylsiloxane | Yu Chen, Quanbo Zou, Pang Dow Foo | 2003-01-07 |