Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12196948 | Electrostatic comb drive-based silicon-based MEMS optical switch and N × N array | Daoxin Dai, Huan Li | 2025-01-14 |
| 11598921 | Ultra-broadband silicon waveguide micro-electro-mechanical systems (MEMS) photonic switch | Daoxin Dai | 2023-03-07 |
| 11380558 | Optical sensor packaging system | Saurabh Nilkanth Athavale, Zhiyong Wang, Tie Wang | 2022-07-05 |
| 10727086 | Optical sensor packaging system | Saurabh Nilkanth Athavale, Zhiyong Wang, Tie Wang | 2020-07-28 |
| 9704726 | Packaging structural member | Chin Hock Toh, Xue Ren Zhang, Ravi Kanth Kolan | 2017-07-11 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar Rahim, Viren Khandekar +1 more | 2017-02-28 |
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Arkadii V. Samoilov, Yong Li Xu | 2016-08-23 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Kumar Nagarajan, Satbir Madra, Yong Li Xu | 2016-07-19 |
| 9343430 | Stacked wafer-level package device | Arkadii V. Samoilov, Tie Wang | 2016-05-17 |
| 9142487 | Packaging structural member | Chin Hock Toh, Xue Ren Zhang, Ravi Kanth Kolan | 2015-09-22 |
| 9093333 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Duane Thomas Wilcoxen, Viren Khandekar, Arkadii V. Samoilov | 2015-07-28 |
| 9087732 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Yong Li Xu, Viren Khandekar, Arkadii V. Samoilov | 2015-07-21 |
| 8772921 | Interposer for semiconductor package | Chin Hock Toh, Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary | 2014-07-08 |
| 8741762 | Through silicon via dies and packages | Hao Liu, Ravi Kanth Kolan, Chin Hock Toh | 2014-06-03 |
| 8686543 | 3D chip package with shielded structures | Albert Bergemont, Uppili Sridhar, Joseph P. Ellul, Elliott Simons | 2014-04-01 |
| 8647924 | Semiconductor package and method of packaging semiconductor devices | Chin Hock Toh, Keng Yuen Au, Reynaldo Vincent H. Sta Agueda, Bee Liang Catherine Ng, Librado Gatbonton +1 more | 2014-02-11 |
| 8643150 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Yong Li Xu, Viren Khandekar, Arkadii V. Samoilov | 2014-02-04 |
| 8586465 | Through silicon via dies and packages | Hao Liu, Ravi Kanth Kolan, Chin Hock Toh | 2013-11-19 |
| 8575493 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Duane Thomas Wilcoxen, Viren Khandekar, Arkadii V. Samoilov | 2013-11-05 |
| 8384203 | Packaging structural member | Chin Hock Toh, Xue Ren Zhang, Ravi Kanth Kolan | 2013-02-26 |
| 7851899 | Multi-chip ball grid array package and method of manufacture | Fung Leng Chen, Seong Kwang Kim, Wee Lim Cha, Wolfgang Hetzel, Jochen Thomas | 2010-12-14 |
| 7339278 | Cavity chip package | Henry Iksan, Seong Kwang Kim, Susanto Tanary, Hien Boon Tan | 2008-03-04 |