Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475559 | Controlling the morphology in metal loaded paste material | Nazanin Davani, Uppili Sridhar | 2019-11-12 |
| 9608130 | Semiconductor device having trench capacitor structure integrated therein | Khanh Tran, Edward Martin Godshalk, Kiyoko Ikeuchi, Anuranjan Srivastava | 2017-03-28 |
| 9520462 | Semiconductor device having capacitor integrated therein | Khanh Tran, Anuranjan Srivastava, Kiyoko Ikeuchi, Scott W. Barry | 2016-12-13 |
| 9196672 | Semiconductor device having capacitor integrated therein | Khanh Tran, Anuranjan Srivastava, Kiyoko Ikeuchi, Scott W. Barry | 2015-11-24 |
| 9023422 | High rate deposition method of magnetic nanocomposites | Uppili Sridhar | 2015-05-05 |
| 8847365 | Inductors and methods for integrated circuits | Khanh Tran, Edward Martin Godshalk, Albert Bergemont | 2014-09-30 |
| 8686543 | 3D chip package with shielded structures | Albert Bergemont, Uppili Sridhar, Yi-Sheng Anthony Sun, Elliott Simons | 2014-04-01 |
| 8344478 | Inductors having inductor axis parallel to substrate surface | Khanh Tran, Edward Martin Godshalk, Albert Bergemont | 2013-01-01 |
| 7943473 | Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme | Khanh Tran, Albert Bergemont | 2011-05-17 |
| 6475873 | Method of forming laser trimmable thin-film resistors in a fully planarized integrated circuit technology | Alexander Kalnitsky, Robert F. Scheer | 2002-11-05 |
| 6358809 | Method of modifying properties of deposited thin film material | Glenn Nobinger, Alexander Kalnitsky, Melvin C. Schmidt, Jonathan François Cornelis Herman, Viktor Zekeriya +2 more | 2002-03-19 |
| 6114227 | Chamber for reducing contamination during chemical vapor deposition | David Leksell, Ming Xi Chan, Jeanne Luce, David Thomas Ryan, Iqbal Shareef +3 more | 2000-09-05 |
| 6079353 | Chamber for reducing contamination during chemical vapor deposition | David Leksell, Ming Xi Chan, Jeanne Luce, David Thomas Ryan, Iqbal Shareef +2 more | 2000-06-27 |
| 5773871 | Integrated circuit structure and method of fabrication thereof | John M. Boyd, Sing-Pin Tay | 1998-06-30 |
| 5726084 | Method for forming integrated circuit structure | John M. Boyd, Sing-Pin Tay | 1998-03-10 |
| 5614750 | Buried layer contact for an integrated circuit structure | John M. Boyd | 1997-03-25 |
| 5516710 | Method of forming a transistor | John M. Boyd, Sing-Pin Tay | 1996-05-14 |
| 5394000 | Trench capacitor structure | John M. Boyd, Michael Rowlandson | 1995-02-28 |
| 5362669 | Method of making integrated circuits | John M. Boyd, Sing-Pin Tay | 1994-11-08 |
| 5352923 | Trench resistors for integrated circuits | John M. Boyd, Sing-Pin Tay | 1994-10-04 |
| 5316978 | Forming resistors for intergrated circuits | John M. Boyd, Sing-Pin Tay | 1994-05-31 |
| 5296258 | Method of forming silicon carbide | Sing-Pin Tay | 1994-03-22 |
| 5275974 | Method of forming electrodes for trench capacitors | John M. Boyd, Michael Rowlandson | 1994-01-04 |
| 5035916 | Optical waveguide and method for its manufacture | Alexander Kalnitsky, Albert R. Boothroyd | 1991-07-30 |
| 4996081 | Method of forming multiple nitride coating on silicon | Sing-Pin Tay | 1991-02-26 |