| 12436337 |
Low loss optical interposer |
Gabriel J. Mendoza, Wenguang Li, Vimal Kamineni, Mark Thompson |
2025-10-07 |
|
| 10211172 |
Wafer-based electronic component packaging |
Anuranjan Srivastava |
2019-02-19 |
$25,223,000 |
| 10056294 |
Techniques for adhesive control between a substrate and a die |
Vivek Swaminathan Sridharan, Srikanth Kulkarni |
2018-08-21 |
$32,527,000 |
| 9882075 |
Light sensor with vertical diode junctions |
Nicole D. Kerness, Christopher F. Edwards, Joy T. Jones, Pirooz Parvarandeh |
2018-01-30 |
$41,082,000 |
| 9704809 |
Fan-out and heterogeneous packaging of electronic components |
Arkadii V. Samoilov, Pirooz Parvarandeh, Amit S. Kelkar |
2017-07-11 |
$13,657,000 |
| 9608130 |
Semiconductor device having trench capacitor structure integrated therein |
Joseph P. Ellul, Edward Martin Godshalk, Kiyoko Ikeuchi, Anuranjan Srivastava |
2017-03-28 |
$10,085,000 |
| 9520462 |
Semiconductor device having capacitor integrated therein |
Joseph P. Ellul, Anuranjan Srivastava, Kiyoko Ikeuchi, Scott W. Barry |
2016-12-13 |
$24,073,000 |
| 9196672 |
Semiconductor device having capacitor integrated therein |
Joseph P. Ellul, Anuranjan Srivastava, Kiyoko Ikeuchi, Scott W. Barry |
2015-11-24 |
$9,611,000 |
| 8847365 |
Inductors and methods for integrated circuits |
Joseph P. Ellul, Edward Martin Godshalk, Albert Bergemont |
2014-09-30 |
$19,269,000 |
| 8344478 |
Inductors having inductor axis parallel to substrate surface |
Joseph P. Ellul, Edward Martin Godshalk, Albert Bergemont |
2013-01-01 |
|
| 8243021 |
Slide and rotate display configurations for a handheld computing device |
Rick Feightner, Wah Yiu Kwong, Katherine Mills, George K. Korinsky |
2012-08-14 |
$13,822,000 |
| 7943473 |
Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme |
Joseph P. Ellul, Albert Bergemont |
2011-05-17 |
$20,819,000 |
| 6607962 |
Globally planarized backend compatible thin film resistor contact/interconnect process |
Viktor Zekeriya |
2003-08-19 |
$152,083,000 |
| 6522013 |
Punch-through via with conformal barrier liner |
Robert Chen, Jeffrey A. Shields, Robert Dawson |
2003-02-18 |
$2,713,000 |
| 6492258 |
METHOD FOR REDUCING STRESS-INDUCED VOIDS FOR 0.25-&mgr;M AND SMALLER SEMICONDUCTOR CHIP TECHNOLOGY BY ANNEALING INTERCONNECT LINES AND USING LOW BIAS VOLTAGE AND LOW INTERLAYER DIELECTRIC DEPOSITION RATE AND SEMICONDUCTOR CHIP MADE THEREBY |
Minh Van Ngo, Paul R. Besser, Matthew S. Buynoski, John Caffall, Nick Maccrae +1 more |
2002-12-10 |
$2,246,000 |
| 6472751 |
H2 diffusion barrier formation by nitrogen incorporation in oxide layer |
Robert Chen, Jeffrey A. Shields, Robert Dawson |
2002-10-29 |
$1,498,000 |
| 6351013 |
Low-K sub spacer pocket formation for gate capacitance reduction |
Scott Luning, David Wu |
2002-02-26 |
$4,948,000 |
| 6329718 |
Method for reducing stress-induced voids for 0.25m.mu. and smaller semiconductor chip technology by annealing interconnect lines and using low bias voltage and low interlayer dielectric deposition rate and semiconductor chip made thereby |
Minh Van Ngo, Paul R. Besser, Matthew S. Buynoski, John Caffall, Nick Maccrae +1 more |
2001-12-11 |
$6,262,000 |
| 6319859 |
Borderless vias with HSQ gap filled metal patterns having high etching resistance |
— |
2001-11-20 |
$3,380,000 |
| 6232221 |
Borderless vias |
Sunil Mehta, Andre Stolmeijer |
2001-05-15 |
$7,906,000 |
| 6232223 |
High integrity borderless vias with protective sidewall spacer |
Sunil Mehta |
2001-05-15 |
$7,906,000 |
| 6194328 |
H2 diffusion barrier formation by nitrogen incorporation in oxide layer |
Robert Chen, Jeffrey A. Shields, Robert Dawson |
2001-02-27 |
$7,317,000 |
| 6163818 |
Streaming memory controller for a PCI bus |
Uoc H. Nguyen, Otto Sperber, David K. Bovaird |
2000-12-19 |
$7,363,000 |
| 6133142 |
Lower metal feature profile with overhanging ARC layer to improve robustness of borderless vias |
Jeff Shields |
2000-10-17 |
$7,276,000 |
| 6100179 |
Electromigration resistant patterned metal layer gap filled with HSQ |
— |
2000-08-08 |
$4,885,000 |
