Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742253 | Selective mold placement on integrated circuit (IC) packages and methods of fabricating | Sayok Chattopadhyay, Rajneesh Kumar | 2023-08-29 |
| 11211263 | Structure for arrayed partial molding of packages | Rajneesh Kumar, Sayok Chattopadhyay | 2021-12-28 |
| 10056294 | Techniques for adhesive control between a substrate and a die | Vivek Swaminathan Sridharan, Khanh Tran | 2018-08-21 |