Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142586 | Efficient redistribution layer topology | Christopher Daniel Manack, Joseph Liu | 2024-11-12 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2024-05-14 |
| 11978709 | Integrated system-in-package with radiation shielding | Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2024-05-07 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11854922 | Semicondutor package substrate with die cavity and redistribution layer | Christopher Daniel Manack, Joseph Liu | 2023-12-26 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2022-08-09 |
| 11380637 | Efficient redistribution layer topology | Christopher Daniel Manack, Joseph Liu | 2022-07-05 |
| 11362047 | Integrated system-in-package with radiation shielding | Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2022-06-14 |
| 10804233 | Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height | Viren Khandekar, Karthik Thambidurai | 2020-10-13 |
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Qiao Chen | 2020-06-02 |
| 10134689 | Warpage compensation metal for wafer level packaging technology | Amit S. Kelkar, Sriram Muthukumar | 2018-11-20 |
| 10056294 | Techniques for adhesive control between a substrate and a die | Srikanth Kulkarni, Khanh Tran | 2018-08-21 |
| 9721912 | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality | Viren Khandekar, Karthik Thambidurai | 2017-08-01 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Qiao Chen | 2016-03-01 |
| 9000587 | Wafer-level thin chip integration | Amit S. Kelkar | 2015-04-07 |
| 8878350 | Semiconductor device having a buffer material and stiffener | Amit S. Kelkar, Peter R. Harper | 2014-11-04 |