Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347742 | IC package with heat spreader | Rongwei Zhang, Woochan Kim | 2025-07-01 |
| 12255115 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Qiao Chen | 2025-03-18 |
| 12009280 | IC package with heat spreader | Rongwei Zhang, Woochan Kim | 2024-06-11 |
| 12009319 | Integrated circuit with metal stop ring outside the scribe seal | Christopher Daniel Manack, Qiao Chen, Michael Todd Wyant, Matthew John Sherbin | 2024-06-11 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone | 2024-05-14 |
| 11942386 | Electronic devices in semiconductor package cavities | Christopher Daniel Manack, Qiao Chen | 2024-03-26 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2023-12-26 |
| 11837518 | Coated semiconductor dies | Michael Todd Wyant, Matthew John Sherbin, Christopher Daniel Manack, You Chye How | 2023-12-05 |
| 11616038 | Interconnect for electronic device | Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal | 2023-03-28 |
| 11562949 | Semiconductor package including undermounted die with exposed backside metal | Christopher Daniel Manack, Madison Paige Koziol | 2023-01-24 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone | 2022-08-09 |
| 10833036 | Interconnect for electronic device | Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal | 2020-11-10 |
| 8531030 | IC device having electromigration resistant feed line structures | Gregory E. Howard | 2013-09-10 |
| 5773986 | Semiconductor wafer contact system and method for contacting a semiconductor wafer | William Williams, III, Scott E. Lindsey, Barbara Vasquez | 1998-06-30 |
| 5714800 | Integrated circuit assembly having a stepped interposer and method | — | 1998-02-03 |
| 5629630 | Semiconductor wafer contact system and method for contacting a semiconductor wafer | William Williams, III, Scott E. Lindsey, Barbara Vasquez | 1997-05-13 |
| 5556808 | Method for aligning a semiconductor device | William Williams, III, Barbara Vasquez, Marlene J. Begay | 1996-09-17 |
| 4758368 | Method for etching silicon wafers using a potassium hydroxide and water etching solution | — | 1988-07-19 |