| 12347742 |
IC package with heat spreader |
Rongwei Zhang, Woochan Kim |
2025-07-01 |
| 12255115 |
Electronic devices in semiconductor package cavities |
Christopher Daniel Manack, Qiao Chen |
2025-03-18 |
| 12009280 |
IC package with heat spreader |
Rongwei Zhang, Woochan Kim |
2024-06-11 |
| 12009319 |
Integrated circuit with metal stop ring outside the scribe seal |
Christopher Daniel Manack, Qiao Chen, Michael Todd Wyant, Matthew John Sherbin |
2024-06-11 |
| 11984418 |
Method of forming brass-coated metals in flip-chip redistribution layers |
Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone |
2024-05-14 |
| 11942386 |
Electronic devices in semiconductor package cavities |
Christopher Daniel Manack, Qiao Chen |
2024-03-26 |
| 11855024 |
Wafer chip scale packages with visible solder fillets |
Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Jonathan Andrew Montoya, Salvatore Frank Pavone |
2023-12-26 |
| 11837518 |
Coated semiconductor dies |
Michael Todd Wyant, Matthew John Sherbin, Christopher Daniel Manack, You Chye How |
2023-12-05 |
| 11616038 |
Interconnect for electronic device |
Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal |
2023-03-28 |
| 11562949 |
Semiconductor package including undermounted die with exposed backside metal |
Christopher Daniel Manack, Madison Paige Koziol |
2023-01-24 |
| 11410947 |
Brass-coated metals in flip-chip redistribution layers |
Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Salvatore Frank Pavone |
2022-08-09 |
| 10833036 |
Interconnect for electronic device |
Christopher Daniel Manack, Stefan Herzer, Rakshit Agrawal |
2020-11-10 |
| 8531030 |
IC device having electromigration resistant feed line structures |
Gregory E. Howard |
2013-09-10 |
| 5773986 |
Semiconductor wafer contact system and method for contacting a semiconductor wafer |
William Williams, III, Scott E. Lindsey, Barbara Vasquez |
1998-06-30 |
| 5714800 |
Integrated circuit assembly having a stepped interposer and method |
— |
1998-02-03 |
| 5629630 |
Semiconductor wafer contact system and method for contacting a semiconductor wafer |
William Williams, III, Scott E. Lindsey, Barbara Vasquez |
1997-05-13 |
| 5556808 |
Method for aligning a semiconductor device |
William Williams, III, Barbara Vasquez, Marlene J. Begay |
1996-09-17 |
| 4758368 |
Method for etching silicon wafers using a potassium hydroxide and water etching solution |
— |
1988-07-19 |
