Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312703 | Neutral pH copper plating solution for undercut reduction | — | 2025-05-27 |
| 12237219 | Contact with bronze material to mitigate undercut | Christopher Daniel Manack, Salvatore Frank Pavone | 2025-02-25 |
| 12180595 | Chemically anchored mold compounds in semiconductor packages | — | 2024-12-31 |
| 12154845 | Semiconductor package with nickel-silver pre-plated leadframe | Bernardo Gallegos | 2024-11-26 |
| 12139569 | Filler particles for polymers | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2024-11-12 |
| 12074096 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Salvatore Frank Pavone | 2024-08-27 |
| 12068221 | Plating for thermal management | Christopher Daniel Manack, Salvatore Frank Pavone | 2024-08-20 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Salvatore Frank Pavone, Patrick Francis Thompson | 2024-05-14 |
| 11938715 | SP2-bonded carbon structures | Luigi Colombo, Benjamin Stassen Cook, Archana Venugopal | 2024-03-26 |
| 11935821 | Quad flat no-lead package with wettable flanges | — | 2024-03-19 |
| 11908776 | Semiconductor device with metal die attach to substrate with multi-size cavity | Benjamin Stassen Cook, Sreenivasan K. Koduri | 2024-02-20 |
| 11854933 | Thermally conductive wafer layer | Benjamin Stassen Cook, Archana Venugopal, Daniel Lee Revier | 2023-12-26 |
| 11848258 | Semiconductor package with nickel-silver pre-plated leadframe | Bernardo Gallegos | 2023-12-19 |
| 11694947 | Multi-pitch leads | Sreenivasan K. Koduri | 2023-07-04 |
| 11594504 | Nickel alloy for semiconductor packaging | Christopher Daniel Manack, Salvatore Frank Pavone | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Christopher Daniel Manack, Salvatore Frank Pavone | 2023-02-21 |
| 11443996 | Zinc layer for a semiconductor die pillar | Keith Edward Johnson, Christopher Daniel Manack, Salvatore Frank Pavone | 2022-09-13 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Salvatore Frank Pavone, Patrick Francis Thompson | 2022-08-09 |
| 11390527 | Multi-layered SP2-bonded carbon tubes | Benjamin Stassen Cook, Luigi Colombo, Archana Venugopal | 2022-07-19 |
| 11370662 | Hexagonal boron nitride structures | Luigi Colombo, Benjamin Stassen Cook, Archana Venugopal | 2022-06-28 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Benjamin Stassen Cook, Daniel Lee Revier, Archana Venugopal | 2022-06-07 |
| 11309388 | Multi-super lattice for switchable arrays | Benjamin Stassen Cook, Luigi Colombo, Archana Venugopal | 2022-04-19 |
| 11282770 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Sreenivasan K. Koduri | 2022-03-22 |
| 11254775 | Filler particles for polymers | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2022-02-22 |
| 11145598 | Lattice bump interconnect | Benjamin Stassen Cook, Archana Venugopal, Luigi Colombo | 2021-10-12 |