Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172374 | Additive process for circular printing | Sean Chang, Benjamin Stassen Cook | 2024-12-24 |
| 12042829 | Methods and apparatus for surface wetting control | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2024-07-23 |
| 12046430 | Liquid metal MEMS switch | Adam Joseph Fruehling, Dishit Paresh Parekh, Benjamin Stassen Cook | 2024-07-23 |
| 11865773 | Additive process for circular printing of electronic devices | Sean Chang, Benjamin Stassen Cook | 2024-01-09 |
| 11869925 | 3D printed semiconductor package | Benjamin Stassen Cook | 2024-01-09 |
| 11854933 | Thermally conductive wafer layer | Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal | 2023-12-26 |
| 11728111 | Liquid metal MEMS switch | Adam Joseph Fruehling, Dishit Paresh Parekh, Benjamin Stassen Cook | 2023-08-15 |
| 11693235 | Lens cleaning via electrowetting | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2023-07-04 |
| 11676930 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury | 2023-06-13 |
| 11607704 | Methods and apparatus for electrostatic control of expelled material for lens cleaners | Benjamin Stassen Cook, Stephen John Fedigan, David Patrick Magee | 2023-03-21 |
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Sean Chang, Benjamin Stassen Cook, Scott R. Summerfelt | 2022-11-01 |
| 11417540 | 3D printed semiconductor package | Benjamin Stassen Cook | 2022-08-16 |
| 11404270 | Microelectronic device substrate formed by additive process | Benjamin Stassen Cook | 2022-08-02 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal | 2022-06-07 |
| 11271296 | Molded packaged antenna | Leon Stiborek, Alexey Berd | 2022-03-08 |
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury | 2021-06-08 |
| 10908414 | Lens cleaning via electrowetting | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2021-02-02 |
| 10910465 | 3D printed semiconductor package | Benjamin Stassen Cook | 2021-02-02 |
| 10886187 | Thermal management in integrated circuit using phononic bandgap structure | Benjamin Stassen Cook | 2021-01-05 |
| 10879151 | Semiconductor package with liquid metal conductors | Dishit Paresh Parekh, Benjamin Stassen Cook, Jo Bito | 2020-12-29 |
| 10861715 | 3D printed semiconductor package | Benjamin Stassen Cook | 2020-12-08 |
| 10833648 | Acoustic management in integrated circuit using phononic bandgap structure | Benjamin Stassen Cook | 2020-11-10 |
| 10788367 | Integrated circuit using photonic bandgap structure | Benjamin Stassen Cook | 2020-09-29 |
| 10780467 | Methods and apparatus for surface wetting control | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2020-09-22 |
| 10622270 | Integrated circuit package with stress directing material | Benjamin Stassen Cook | 2020-04-14 |