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Home › Texas Instruments › Daniel Lee Revier

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Daniel Lee Revier — 32 Patents

TITexas Instruments: 32 patents #295 of 12,488Top 3%

Addison, TX: #7 of 196 inventorsTop 4%

Texas: #3,566 of 125,132 inventorsTop 3%

Overall (All Time): #110,428 of 4,157,543Top 3%

32 Patents All Time

Daniel Lee Revier has been granted 32 US patents while listed as an inventor at Texas Instruments. The first was granted in 2019 and the most recent in October 2025. Daniel Lee Revier ranks #110,428 of 4,157,543 US inventors in our database (top 2.7%). Patent records list Daniel Lee Revier in Addison, TX, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12457756	3D printed semiconductor package	Benjamin Stassen Cook	2025-10-28
12172374	Additive process for circular printing	Sean Chang, Benjamin Stassen Cook	2024-12-24	$52,373,000
12042829	Methods and apparatus for surface wetting control	Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan	2024-07-23	$32,250,000
12046430	Liquid metal MEMS switch	Adam Joseph Fruehling, Dishit Paresh Parekh, Benjamin Stassen Cook	2024-07-23	$32,250,000
11865773	Additive process for circular printing of electronic devices	Sean Chang, Benjamin Stassen Cook	2024-01-09	$22,697,000
11869925	3D printed semiconductor package	Benjamin Stassen Cook	2024-01-09	$22,697,000
11854933	Thermally conductive wafer layer	Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal	2023-12-26	$25,539,000
11728111	Liquid metal MEMS switch	Adam Joseph Fruehling, Dishit Paresh Parekh, Benjamin Stassen Cook	2023-08-15	$48,295,000
11693235	Lens cleaning via electrowetting	Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan	2023-07-04
11676930	Nanoparticle backside die adhesion layer	Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury	2023-06-13	$30,659,000
11607704	Methods and apparatus for electrostatic control of expelled material for lens cleaners	Benjamin Stassen Cook, Stephen John Fedigan, David Patrick Magee	2023-03-21	$43,133,000
11487206	Methods and apparatus for digital material deposition onto semiconductor wafers	Sean Chang, Benjamin Stassen Cook, Scott R. Summerfelt	2022-11-01	$44,906,000
11417540	3D printed semiconductor package	Benjamin Stassen Cook	2022-08-16	$28,299,000
11404270	Microelectronic device substrate formed by additive process	Benjamin Stassen Cook	2022-08-02	$48,040,000
11355414	Nanoparticle matrix for backside heat spreading	Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal	2022-06-07	$27,967,000
11271296	Molded packaged antenna	Leon Stiborek, Alexey Berd	2022-03-08	$40,508,000
11031364	Nanoparticle backside die adhesion layer	Benjamin Stassen Cook, Sadia Naseem, Mahmud Halim Chowdhury	2021-06-08	$50,580,000
10908414	Lens cleaning via electrowetting	Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan	2021-02-02	$39,672,000
10910465	3D printed semiconductor package	Benjamin Stassen Cook	2021-02-02	$39,672,000
10886187	Thermal management in integrated circuit using phononic bandgap structure	Benjamin Stassen Cook	2021-01-05	$41,850,000
10879151	Semiconductor package with liquid metal conductors	Dishit Paresh Parekh, Benjamin Stassen Cook, Jo Bito	2020-12-29	$32,545,000
10861715	3D printed semiconductor package	Benjamin Stassen Cook	2020-12-08	$35,035,000
10833648	Acoustic management in integrated circuit using phononic bandgap structure	Benjamin Stassen Cook	2020-11-10	$40,893,000
10788367	Integrated circuit using photonic bandgap structure	Benjamin Stassen Cook	2020-09-29	$48,971,000
10780467	Methods and apparatus for surface wetting control	Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan	2020-09-22	$22,203,000