Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389640 | High voltage avalanche diode for active clamp drivers | Henry Litzmann Edwards, Joseph Maurice Khayat | 2025-08-12 |
| 12342719 | Embedded thermoelectric cooler using thermally anisotropic mesas for power device heat generating source temperature reduction | Jingjing Chen | 2025-06-24 |
| 12139569 | Filler particles for polymers | Nazila Dadvand, Benjamin Stassen Cook, Luigi Colombo | 2024-11-12 |
| 11996343 | Thermal routing trench by additive processing | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2024-05-28 |
| 11984475 | High voltage avalanche diode for active clamp drivers | Henry Litzmann Edwards, Joseph Maurice Khayat | 2024-05-14 |
| 11938715 | SP2-bonded carbon structures | Luigi Colombo, Nazila Dadvand, Benjamin Stassen Cook | 2024-03-26 |
| 11854933 | Thermally conductive wafer layer | Benjamin Stassen Cook, Nazila Dadvand, Daniel Lee Revier | 2023-12-26 |
| 11676880 | High thermal conductivity vias by additive processing | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2023-06-13 |
| 11390527 | Multi-layered SP2-bonded carbon tubes | Benjamin Stassen Cook, Nazila Dadvand, Luigi Colombo | 2022-07-19 |
| 11370662 | Hexagonal boron nitride structures | Luigi Colombo, Nazila Dadvand, Benjamin Stassen Cook | 2022-06-28 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Benjamin Stassen Cook, Nazila Dadvand, Daniel Lee Revier | 2022-06-07 |
| 11309388 | Multi-super lattice for switchable arrays | Benjamin Stassen Cook, Luigi Colombo, Nazila Dadvand | 2022-04-19 |
| 11296237 | Integration of graphene and boron nitride hetero-structure device over semiconductor layer | Luigi Colombo, Arup Polley | 2022-04-05 |
| 11254775 | Filler particles for polymers | Nazila Dadvand, Benjamin Stassen Cook, Luigi Colombo | 2022-02-22 |
| 11145598 | Lattice bump interconnect | Benjamin Stassen Cook, Nazila Dadvand, Luigi Colombo | 2021-10-12 |
| 11081593 | Integration of graphene and boron nitride hetero-structure device | Luigi Colombo | 2021-08-03 |
| 11063120 | Metal-graphene structures forming a lattice of interconnected segments | Luigi Colombo, Benjamin Stassen Cook, Nazila Dadvand | 2021-07-13 |
| 11004680 | Semiconductor device package thermal conduit | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2021-05-11 |
| 10923567 | Graphene FET with graphitic interface layer at contacts | Luigi Colombo | 2021-02-16 |
| 10861763 | Thermal routing trench by additive processing | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2020-12-08 |
| 10811334 | Integrated circuit nanoparticle thermal routing structure in interconnect region | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2020-10-20 |
| 10804201 | Dissimilar material interface having lattices | Benjamin Stassen Cook, Nazila Dadvand, Luigi Colombo | 2020-10-13 |
| 10790228 | Interconnect via with grown graphitic material | Benjamin Stassen Cook, Luigi Colombo, Robert Reid Doering | 2020-09-29 |
| 10748999 | Multi-super lattice for switchable arrays | Benjamin Stassen Cook, Luigi Colombo, Nazila Dadvand | 2020-08-18 |
| 10741473 | Structure to enable higher current density in integrated circuit resistor | Dhishan Kande | 2020-08-11 |