| 12500082 |
Semicondctor device package thermal conduit |
Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering |
2025-12-16 |
|
| 12338549 |
Method and system for liquid encapsulated growth of cadmium zinc telluride crystals |
Lance Robertson, Victor Perez-Rubio, Tim Svoboda, Fred Harris, Kathryn M. O'Brien |
2025-06-24 |
|
| 12139569 |
Filler particles for polymers |
Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal |
2024-11-12 |
$32,376,000 |
| 11996343 |
Thermal routing trench by additive processing |
Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering |
2024-05-28 |
$32,000,000 |
| 11938715 |
SP2-bonded carbon structures |
Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal |
2024-03-26 |
$28,354,000 |
| 11866848 |
Method and system for liquid encapsulated growth of cadmium zinc telluride crystals |
Lance Robertson, Victor Perez-Rubio, Tim Svoboda, Fred Harris, Kathryn M. O'Brien |
2024-01-09 |
|
| 11710764 |
IC with 3D metal-insulator-metal capacitor |
Poornika Fernandes, Sagnik Dey, Haowen Bu, Scott R. Summerfelt, Mark Visokay +1 more |
2023-07-25 |
$54,322,000 |
| 11676880 |
High thermal conductivity vias by additive processing |
Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering |
2023-06-13 |
$30,659,000 |
| 11670671 |
Precision capacitor |
Poornika Fernandes, Haowen Bu |
2023-06-06 |
$37,069,000 |
| 11569342 |
Precision capacitor |
Poornika Fernandes, Haowen Bu |
2023-01-31 |
$26,595,000 |
| 11390527 |
Multi-layered SP2-bonded carbon tubes |
Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal |
2022-07-19 |
$38,640,000 |
| 11370662 |
Hexagonal boron nitride structures |
Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal |
2022-06-28 |
$26,335,000 |
| 11309388 |
Multi-super lattice for switchable arrays |
Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal |
2022-04-19 |
$45,950,000 |
| 11296237 |
Integration of graphene and boron nitride hetero-structure device over semiconductor layer |
Archana Venugopal, Arup Polley |
2022-04-05 |
$36,821,000 |
| 11254775 |
Filler particles for polymers |
Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal |
2022-02-22 |
$26,617,000 |
| 11145598 |
Lattice bump interconnect |
Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal |
2021-10-12 |
$54,099,000 |
| 11081593 |
Integration of graphene and boron nitride hetero-structure device |
Archana Venugopal |
2021-08-03 |
$28,719,000 |
| 11063120 |
Metal-graphene structures forming a lattice of interconnected segments |
Archana Venugopal, Benjamin Stassen Cook, Nazila Dadvand |
2021-07-13 |
$42,316,000 |
| 11004680 |
Semiconductor device package thermal conduit |
Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering |
2021-05-11 |
$37,394,000 |
| 10964778 |
Precision capacitor |
Poornika Fernandes, Haowen Bu |
2021-03-30 |
$42,681,000 |
| 10923567 |
Graphene FET with graphitic interface layer at contacts |
Archana Venugopal |
2021-02-16 |
$41,790,000 |
| 10861763 |
Thermal routing trench by additive processing |
Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering |
2020-12-08 |
$35,035,000 |
| 10811334 |
Integrated circuit nanoparticle thermal routing structure in interconnect region |
Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering |
2020-10-20 |
$20,699,000 |
| 10804201 |
Dissimilar material interface having lattices |
Archana Venugopal, Benjamin Stassen Cook, Nazila Dadvand |
2020-10-13 |
$33,902,000 |
| 10790228 |
Interconnect via with grown graphitic material |
Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering |
2020-09-29 |
$48,971,000 |
