LC

Luigi Colombo

TI Texas Instruments: 117 patents #26 of 12,488Top 1%
University Of Texas System: 5 patents #550 of 6,559Top 9%
AT Agilent Technologies: 4 patents #561 of 3,411Top 20%
GS Gruppo Lepetit S.P.A.: 3 patents #34 of 111Top 35%
DS Drs Network & Imaging Systems: 2 patents #25 of 78Top 35%
TL Tokyo Electron Limited: 1 patents #3,538 of 5,567Top 65%
VP Vicuron Pharmaceuticals: 1 patents #28 of 48Top 60%
RTX (Raytheon): 1 patents #8,248 of 15,912Top 55%
Overall (All Time): #8,395 of 4,157,543Top 1%
130
Patents All Time

Issued Patents All Time

Showing 25 most recent of 130 patents

Patent #TitleCo-InventorsDate
12338549 Method and system for liquid encapsulated growth of cadmium zinc telluride crystals Lance Robertson, Victor Perez-Rubio, Tim Svoboda, Fred Harris, Kathryn M. O'Brien 2025-06-24
12139569 Filler particles for polymers Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal 2024-11-12
11996343 Thermal routing trench by additive processing Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering 2024-05-28
11938715 SP2-bonded carbon structures Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal 2024-03-26
11866848 Method and system for liquid encapsulated growth of cadmium zinc telluride crystals Lance Robertson, Victor Perez-Rubio, Tim Svoboda, Fred Harris, Kathryn M. O'Brien 2024-01-09
11710764 IC with 3D metal-insulator-metal capacitor Poornika Fernandes, Sagnik Dey, Haowen Bu, Scott R. Summerfelt, Mark Visokay +1 more 2023-07-25
11676880 High thermal conductivity vias by additive processing Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering 2023-06-13
11670671 Precision capacitor Poornika Fernandes, Haowen Bu 2023-06-06
11569342 Precision capacitor Poornika Fernandes, Haowen Bu 2023-01-31
11390527 Multi-layered SP2-bonded carbon tubes Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal 2022-07-19
11370662 Hexagonal boron nitride structures Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal 2022-06-28
11309388 Multi-super lattice for switchable arrays Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal 2022-04-19
11296237 Integration of graphene and boron nitride hetero-structure device over semiconductor layer Archana Venugopal, Arup Polley 2022-04-05
11254775 Filler particles for polymers Nazila Dadvand, Benjamin Stassen Cook, Archana Venugopal 2022-02-22
11145598 Lattice bump interconnect Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal 2021-10-12
11081593 Integration of graphene and boron nitride hetero-structure device Archana Venugopal 2021-08-03
11063120 Metal-graphene structures forming a lattice of interconnected segments Archana Venugopal, Benjamin Stassen Cook, Nazila Dadvand 2021-07-13
11004680 Semiconductor device package thermal conduit Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering 2021-05-11
10964778 Precision capacitor Poornika Fernandes, Haowen Bu 2021-03-30
10923567 Graphene FET with graphitic interface layer at contacts Archana Venugopal 2021-02-16
10861763 Thermal routing trench by additive processing Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering 2020-12-08
10811334 Integrated circuit nanoparticle thermal routing structure in interconnect region Benjamin Stassen Cook, Archana Venugopal, Robert Reid Doering 2020-10-20
10804201 Dissimilar material interface having lattices Archana Venugopal, Benjamin Stassen Cook, Nazila Dadvand 2020-10-13
10790228 Interconnect via with grown graphitic material Archana Venugopal, Benjamin Stassen Cook, Robert Reid Doering 2020-09-29
10748999 Multi-super lattice for switchable arrays Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal 2020-08-18