Issued Patents All Time
Showing 1–25 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417914 | Technique for GaN epitaxy on insulating substrates | Nicholas Stephen Dellas | 2025-09-16 |
| 12191554 | Acoustic waveguide with diffraction grating | Bichoy Bahr, Benjamin Stassen Cook | 2025-01-07 |
| 12148717 | Through wafer trench isolation between transistors in an integrated circuit | Thomas D. Bonifield, Sreeram Subramanyam Nasum, Peter Smeys, Benjamin Stassen Cook | 2024-11-19 |
| 11834331 | MEMS encapsulation employing lower pressure and higher pressure deposition processes | Adam Joseph Fruehling | 2023-12-05 |
| 11815526 | Aging compensation of a ferroelectric piezoelectric shock sensor | Benjamin Stassen Cook | 2023-11-14 |
| 11791296 | Dielectric and metallic nanowire bond layers | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2023-10-17 |
| 11710764 | IC with 3D metal-insulator-metal capacitor | Poornika Fernandes, Sagnik Dey, Luigi Colombo, Haowen Bu, Mark Visokay +1 more | 2023-07-25 |
| 11567026 | PH sensor | Ernst Muellner, Sebastian Meier, Markus Hefele | 2023-01-31 |
| 11495607 | Low-temperature passivation of ferroelectric integrated circuits for enhanced polarization performance | Huang-Chun Wen, Richard A. Bailey, Antonio Guillermo Acosta, John Anthony Rodriguez, Kemal Tamer San | 2022-11-08 |
| 11487381 | Piezoelectric sensor apparatus | Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Alok Kumar Lohia, Terry Lee Sculley +1 more | 2022-11-01 |
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Sean Chang, Benjamin Stassen Cook | 2022-11-01 |
| 11387919 | High frequency CMOS ultrasonic transducer | Bichoy Bahr, Benjamin Stassen Cook | 2022-07-12 |
| 11387271 | Optical sensor with trench etched through dielectric over silicon | Hassan Ali, Benjamin Stassen Cook | 2022-07-12 |
| 11320453 | Aging compensation of a ferroelectric piezoelectric shock sensor | Benjamin Stassen Cook | 2022-05-03 |
| 11303288 | Oscillator self-calibration | Bichoy Bahr, Kaichien Tsai | 2022-04-12 |
| 11251138 | Through wafer trench isolation between transistors in an integrated circuit | Thomas D. Bonifield, Sreeram Subramanyam Nasum, Peter Smeys, Benjamin Stassen Cook | 2022-02-15 |
| 11195811 | Dielectric and metallic nanowire bond layers | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2021-12-07 |
| 11049980 | Integrated MIM diode | Benjamin Stassen Cook | 2021-06-29 |
| 10911055 | Oscillator self-calibration | Bichoy Bahr, Kaichien Tsai | 2021-02-02 |
| 10873020 | Piezoelectric sensing apparatus and method | Wei-Yan Shih, Sudhanshu Khanna, Michael Zwerg, Juergen Luebbe, Gregory Allen North +2 more | 2020-12-22 |
| 10353503 | Integrated force sensing element | Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Alok Kumar Lohia, Terry Lee Sculley +1 more | 2019-07-16 |
| 9991120 | Dilution doped integrated circuit resistors | Scott Montgomery | 2018-06-05 |
| 9773793 | Transistor performance modification with stressor structures | Rajni J. Aggarwal, Shaoping Tang | 2017-09-26 |
| 9619606 | Adjustable dummy fill | Robert G. Fleck | 2017-04-11 |
| 9536822 | Drawn dummy FeCAP, via and metal structures | Rajni J. Aggarwal | 2017-01-03 |