Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255077 | Method for creating a wettable surface for improved reliability in QFN packages | Vikas Gupta | 2025-03-18 |
| 11791168 | Method for creating a wettable surface for improved reliability in QFN packages | Vikas Gupta | 2023-10-17 |
| 11735806 | Wireless device with waveguiding structures between radiating structures and waveguide feeds | Vikas Gupta, Meysam Moallem | 2023-08-22 |
| 11676930 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Daniel Lee Revier, Mahmud Halim Chowdhury | 2023-06-13 |
| 11677152 | Packaged electronic device with integral antenna | Vikas Gupta, Meysam Moallem | 2023-06-13 |
| 11031364 | Nanoparticle backside die adhesion layer | Benjamin Stassen Cook, Daniel Lee Revier, Mahmud Halim Chowdhury | 2021-06-08 |
| 10916448 | Method for creating a wettable surface for improved reliability in QFN packages | Vikas Gupta | 2021-02-09 |
| 10559524 | 2-step die attach for reduced pedestal size of laminate component packages | Vikas Gupta, Rongwei Zhang | 2020-02-11 |