Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255168 | Electronic device with multi-layer contact and system | Alexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Tobias Schmidt | 2025-03-18 |
| 11842975 | Electronic device with multi-layer contact and system | Alexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Tobias Schmidt | 2023-12-12 |
| 10475761 | Method for producing electronic device with multi-layer contact | Alexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Tobias Schmidt | 2019-11-12 |
| 9490193 | Electronic device with multi-layer contact | Alexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Tobias Schmidt | 2016-11-08 |
| 9373609 | Bump package and methods of formation thereof | Meng Tong Ong, Thiam Huat Lim | 2016-06-21 |
| 9275944 | Semiconductor package with multi-level die block | — | 2016-03-01 |
| 9209152 | Molding material and method for packaging semiconductor chips | Meng Tong Ong | 2015-12-08 |
| 9054063 | High power single-die semiconductor package | Meng Tong Ong | 2015-06-09 |