Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255168 | Electronic device with multi-layer contact and system | Alexander Heinrich, Michael Juerss, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2025-03-18 |
| 12166005 | Semiconductor device having a soldered joint with one or more intermetallic phases | Alexander Heinrich, Kirill Trunov, Arthur Unrau | 2024-12-10 |
| 11842975 | Electronic device with multi-layer contact and system | Alexander Heinrich, Michael Juerss, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2023-12-12 |
| 11605608 | Preform diffusion soldering | Alexander Heinrich, Kirill Trunov, Arthur Unrau | 2023-03-14 |
| 11158602 | Batch diffusion soldering and electronic devices produced by batch diffusion soldering | Kirill Trunov, Alexander Heinrich, Arthur Unrau | 2021-10-26 |
| 10475761 | Method for producing electronic device with multi-layer contact | Alexander Heinrich, Michael Juerss, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2019-11-12 |
| 9673170 | Batch process for connecting chips to a carrier | Rupert Fischer, Peter Strobel, Joachim Mahler, Alexander Heinrich | 2017-06-06 |
| 9490193 | Electronic device with multi-layer contact | Alexander Heinrich, Michael Juerss, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2016-11-08 |
| 9079318 | Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head | Horst Groeninger | 2015-07-14 |
| 9034751 | Method for mounting a semiconductor chip on a carrier | Alexander Heinrich, Oliver Eichinger | 2015-05-19 |
| 8802553 | Method for mounting a semiconductor chip on a carrier | Alexander Heinrich, Oliver Eichinger | 2014-08-12 |
| 7874475 | Method for the planar joining of components of semiconductor devices and a diffusion joining structure | Khalil Hosseini, Joachim Mahler, Edmund Riedl, Ivan Galesic | 2011-01-25 |
| 7781897 | Semiconductor device and method for producing the same | Khalil Hosseini, Eduard Knauer, Joachim Mahler, Peter Mederer | 2010-08-24 |