Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255168 | Electronic device with multi-layer contact and system | Alexander Heinrich, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2025-03-18 |
| 11842975 | Electronic device with multi-layer contact and system | Alexander Heinrich, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2023-12-12 |
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Bun Kian Tay, Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Josef Maerz +3 more | 2022-11-29 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber +2 more | 2021-01-05 |
| 10475761 | Method for producing electronic device with multi-layer contact | Alexander Heinrich, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2019-11-12 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Edward Fuergut, Holger Doepke, Olaf Hohlfeld | 2018-08-07 |
| 9953952 | Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier | Joachim Mahler, Stefan Landau | 2018-04-24 |
| 9490193 | Electronic device with multi-layer contact | Alexander Heinrich, Konrad Roesl, Oliver Eichinger, Kok Chai Goh, Tobias Schmidt | 2016-11-08 |