Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515244 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Mei Yih Goh, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz +3 more | 2022-11-29 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Wee Boon Tay, Wae Chet Yong | 2021-04-13 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz +1 more | 2021-03-30 |