Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394697 | Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Martin Gruber, Thorsten Meyer, Frank Singer | 2025-08-19 |
| 12334405 | Electronic devices including vent openings and associated methods | Michael Stadler | 2025-06-17 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Martin Gruber, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11869830 | Semiconductor package and clip with a die attach | Michael Stadler | 2024-01-09 |
| 11869865 | Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof | Chooi Mei Chong, Edward Myers, Michael Stadler | 2024-01-09 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Martin Gruber, Martin Richard Niessner | 2024-01-02 |
| 11088105 | Semiconductor device and method for fabricating a semiconductor device | Chooi Mei Chong, Edward Myers, Michael Stadler | 2021-08-10 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thai Kee Gan, Azlina Kassim | 2021-07-20 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong | 2021-04-13 |
| 10971457 | Semiconductor device comprising a composite material clip | Martin Gruber, Thorsten Scharf | 2021-04-06 |
| 10950509 | Semiconductor device with integrated shunt resistor | Rainald Sander, Steffen Thiele | 2021-03-16 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |
| 10840172 | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | Azlina Kassim, Nurfarena Othman | 2020-11-17 |
| 10026710 | Electronic arrangement | Simon Jerebic, Markus Pindl | 2018-07-17 |
| 9681566 | Electronic arrangement and method for producing an electronic arrangement | Simon Jerebic, Markus Pindl | 2017-06-13 |
| 9484278 | Semiconductor package and method for producing the same | — | 2016-11-01 |
| 9443760 | Multichip power semiconductor device | Joachim Mahler, Anton Prueckl | 2016-09-13 |
| 8916968 | Multichip power semiconductor device | Joachim Mahler, Anton Prueckl | 2014-12-23 |
| 8848297 | Lens, optoelectronic component comprising a lens and method for producing a lens | Ulrich Streppel, Bert Braune | 2014-09-30 |
| 8748201 | Process for producing a layer composite consisting of a luminescence conversion layer and a scattering layer | Stephan Preuss | 2014-06-10 |
| 8030741 | Electronic device | Thomas Mende, Bernd Rakow | 2011-10-04 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Michael Bauer, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss +1 more | 2011-05-17 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls | Michael Bauer, Edward Fuergut, Simon Jerebic, Herman Vilsmeier | 2011-05-03 |
| 7800241 | Semiconductor device with semiconductor device components embedded in a plastics composition | Michael Bauer, Edward Fuergut | 2010-09-21 |
| 7737537 | Electronic device | Thomas Mende, Bernd Rakow | 2010-06-15 |