Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020245 | Laminate electronic device | Henrik Ewe, Joachim Mahler, Stefan Landau | 2018-07-10 |
| 9607966 | Chip arrangement | — | 2017-03-28 |
| 9576944 | Semiconductor devices with transistor cells and thermoresistive element | Johannes Georg Laven, Christian Jaeger, Joachim Mahler, Daniel Pedone, Hans-Joachim Schulze +2 more | 2017-02-21 |
| 9443760 | Multichip power semiconductor device | Joachim Mahler, Thomas Bemmerl | 2016-09-13 |
| 9437548 | Chip package and method for manufacturing the same | Henrik Ewe, Joachim Mahler, Frank Daeche, Josef Hoeglauer, Riccardo Pittassi | 2016-09-06 |
| 9123687 | Method of manufacturing a semiconductor device | Henrik Ewe, Joachim Mahler | 2015-09-01 |
| 9059155 | Chip package and method for manufacturing the same | Henrik Ewe, Joachim Mahler, Frank Daeche, Josef Hoeglauer, Riccardo Pittassi | 2015-06-16 |
| 9018773 | Chip arrangement and a method for forming a chip arrangement | — | 2015-04-28 |
| 8916968 | Multichip power semiconductor device | Joachim Mahler, Thomas Bemmerl | 2014-12-23 |
| 8866274 | Semiconductor packages and methods of formation thereof | Hermann Gruber, Joachim Mahler, Uwe Hoeckele, Thomas Fischer, Matthias Schmidt | 2014-10-21 |
| 8866302 | Device including two semiconductor chips and manufacturing thereof | Henrik Ewe, Joachim Mahler, Stefan Landau | 2014-10-21 |
| 8847385 | Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package | Joachim Mahler, Ralf Wombacher | 2014-09-30 |
| 8698298 | Laminate electronic device | Ewe Henrik, Joachim Mahler, Ivan Nikitin | 2014-04-15 |
| 8686569 | Die arrangement and method of forming a die arrangement | Frank Daeche, Joachim Mahler, Stefan Landau, Josef Hoeglauer | 2014-04-01 |
| 8664043 | Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts | Henrik Ewe, Joachim Mahler, Stefan Landau | 2014-03-04 |
| 8648473 | Chip arrangement and a method for forming a chip arrangement | — | 2014-02-11 |
| 8598694 | Chip-package having a cavity and a manufacturing method thereof | Khalil Hosseini, Joachim Mahler | 2013-12-03 |
| 8201326 | Method of manufacturing a semiconductor device | Henrik Ewe, Joachim Mahler | 2012-06-19 |
| 8120158 | Laminate electronic device | Henrik Ewe, Joachim Mahler, Ivan Nikitin | 2012-02-21 |