Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913656 | Method for sealing an access opening to a cavity and MEMS component comprising a sealing element | Gerhard Metzger-Brueckl, Alfons Dehe, Johann Strasser, Arnaud Walther | 2021-02-09 |
| 10854669 | Method of manufacturing an imager and imager device | Dirk Meinhold, Emanuele Bruno Bodini, Felix Braun, Hermann Gruber, Dirk Offenberg +2 more | 2020-12-01 |
| 10692921 | Method of manufacturing an imager and imager device | Dirk Meinhold, Emanuele Bruno Bodini, Felix Braun, Hermann Gruber, Dirk Offenberg +2 more | 2020-06-23 |
| 10411060 | Method of manufacturing an imager and imager device | Dirk Meinhold, Emanuele Bruno Bodini, Felix Braun, Hermann Gruber, Dirk Offenberg +2 more | 2019-09-10 |
| 10332814 | Bonded system and a method for adhesively bonding a hygroscopic material | Claus von Waechter, Christian Altschaeffl, Holger Doepke, Franz-Xaver Muehlbauer, Daniel Porwol +3 more | 2019-06-25 |
| 9728480 | Passivation layer and method of making a passivation layer | Kurt Matoy, Hubert Maier, Christian Krenn, Elfriede Kraxner Wellenzohn, Helmut Schoenherr +5 more | 2017-08-08 |
| 9659992 | Method of manufacturing an imager and imager device | Dirk Meinhold, Emanuele Bruno Bodini, Felix Braun, Hermann Gruber, Dirk Offenberg +2 more | 2017-05-23 |
| 9236290 | Method for producing a semiconductor device | Carsten Ahrens, Rudolf Berger, Manfred Frank, Bernhard Knott, Ulrich Krumbein +4 more | 2016-01-12 |
| 9006898 | Conductive lines and pads and method of manufacturing thereof | Roland Hampp, Thomas Fischer | 2015-04-14 |
| 8999187 | Method for manufacturing a device on a substrate | Sandra Obernhuber, Christof Jalics, Joerg Adler, Walter Preis, Reinhard Goellner +2 more | 2015-04-07 |
| 8927419 | Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive | — | 2015-01-06 |
| 8866274 | Semiconductor packages and methods of formation thereof | Hermann Gruber, Joachim Mahler, Anton Prueckl, Thomas Fischer, Matthias Schmidt | 2014-10-21 |
| 8815743 | Through substrate via semiconductor components and methods of formation thereof | Albert Birner, Thomas Kunstmann, Uwe Seidel | 2014-08-26 |
| 8597531 | Method for manufacturing a device on a substrate | Sandra Obernhuber, Christof Jalics, Joerg Adler, Walter Preis, Reinhard Goellner +2 more | 2013-12-03 |
| 8598593 | Chip comprising an integrated circuit, fabrication method and method for locally rendering a carbonic layer conductive | — | 2013-12-03 |
| 8586472 | Conductive lines and pads and method of manufacturing thereof | Roland Hampp, Thomas Fischer | 2013-11-19 |
| 8399936 | Through substrate via semiconductor components | Albert Birner, Thomas Kunstmann, Uwe Seidel | 2013-03-19 |
| 7834427 | Integrated circuit having a semiconductor arrangement | Thomas Detzel, Hubert Maier, Kai-Alexander Schreiber, Stefan Woehlert | 2010-11-16 |
| 7772123 | Through substrate via semiconductor components | Albert Birner, Thomas Kunstmann, Uwe Seidel | 2010-08-10 |