Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112992 | Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component | Thomas Fischer, Uwe Seidel, Anton Steltenpohl | 2024-10-08 |
| 11605572 | Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer | Thomas Fischer, Uwe Seidel, Anton Steltenpohl | 2023-03-14 |
| 11279120 | Device and method for debonding a structure from a main surface region of a carrier | Alfred Sigi, Dominic Maier | 2022-03-22 |
| 10694584 | Infrared emitter arrangement and method for producing an infrared emitter arrangement | Stephan Pindl, Johann Strasser | 2020-06-23 |
| 10600690 | Method for handling a product substrate and a bonded substrate system | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier +1 more | 2020-03-24 |
| 10483133 | Method for fabricating a semiconductor chip panel | Edward Fuergut | 2019-11-19 |
| 10332814 | Bonded system and a method for adhesively bonding a hygroscopic material | Claus von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz-Xaver Muehlbauer +3 more | 2019-06-25 |
| 10056295 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Georg Meyer-Berg, Claus von Waechter, Michael Bauer, Holger Doepke, Dominic Maier +1 more | 2018-08-21 |
| 9988262 | Temporary mechanical stabilization of semiconductor cavities | Dominic Maier, Joachim Mahler, Alfred Sigl | 2018-06-05 |
| 9981843 | Chip package and a method of producing the same | Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz-Xaver Muehlbauer +1 more | 2018-05-29 |
| 9953846 | Method for fabricating a semiconductor chip panel | Edward Fuergut | 2018-04-24 |
| 9455160 | Method for fabricating a semiconductor chip panel | Edward Fuergut | 2016-09-27 |
| 8906749 | Method for fabricating a semiconductor device | Michael Bauer, Ulrich Wachter | 2014-12-09 |
| 8394308 | Mold method | Markus Brunnbauer, Edward Fuergut | 2013-03-12 |
| 8173488 | Electronic device and method of manufacturing same | Michael Bauer, Ludwig Heitzer | 2012-05-08 |
| 8158046 | Mold apparatus and method | Markus Brunnbauer, Edward Fuergut | 2012-04-17 |
| 7943423 | Reconfigured wafer alignment | Jens Pohl, Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel +1 more | 2011-05-17 |