Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374923 | Method of operating an apparatus for wirelessly transmitting electrical power in the direction of an electrical consumer and system | Christian Egenter, Ralf Pawlowitsch, Jan Draak, Klaas Jakob Lulofs | 2025-07-29 |
| 9806056 | Method of packaging integrated circuits | Dominic Maier, Thomas Kilger | 2017-10-31 |
| 9718678 | Package arrangement, a package, and a method of manufacturing a package arrangement | Thomas Kilger | 2017-08-01 |
| 9711462 | Package arrangement including external block comprising semiconductor material and electrically conductive plastic material | Gottfried Beer, Dominic Maier, Daniel Kehrer | 2017-07-18 |
| 9620457 | Semiconductor device packaging | Eva Wagner, Gottfried Beer | 2017-04-11 |
| 9487392 | Method of packaging integrated circuits and a molded package | Dominic Maier, Thomas Kilger | 2016-11-08 |
| 9275878 | Metal redistribution layer for molded substrates | Dominic Maier, Thomas Kilger | 2016-03-01 |
| 9147585 | Method for fabricating a plurality of semiconductor devices | Thomas Kilger, Dominic Maier, Gottfried Beer | 2015-09-29 |
| 9099454 | Molded semiconductor package with backside die metallization | Veronika Huber, Thomas Kilger, Ralf Otremba, Bernd Stadler, Dominic Maier +3 more | 2015-08-04 |
| 8912087 | Method of fabricating a chip package | Josef Hirtreiter, Walter Hartner, Juergen Foerster | 2014-12-16 |
| 8906749 | Method for fabricating a semiconductor device | Michael Bauer, Daniel Porwol | 2014-12-09 |
| 8890284 | Semiconductor device | Thomas Kilger, Dominic Maier, Gottfried Beer | 2014-11-18 |
| 8828807 | Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound | Dominic Maier, Thomas Kilger | 2014-09-09 |
| 8669655 | Chip package and a method for manufacturing a chip package | Ottmar Geitner, Walter Hartner, Maciej Wojnowski, Michael Bauer, Andreas Stueckjuergen | 2014-03-11 |
| 7943423 | Reconfigured wafer alignment | Jens Pohl, Edward Fuergut, Markus Brunnbauer, Thorsten Meyer, Peter Strobel +1 more | 2011-05-17 |