Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094842 | Semiconductor device having an antenna arranged over an active main surface of a semiconductor die | Thorsten Meyer, Walter Hartner | 2024-09-17 |
| 12040543 | Radio-frequency devices and methods for producing radio-frequency devices | Walter Hartner, Tuncay ERDOEL, Klaus Elian, Christian Geissler, Bernhard Rieder +2 more | 2024-07-16 |
| 12014998 | Semiconductor devices comprising a radar semiconductor chip and associated production methods | Ernst Seler, Markus Lang | 2024-06-18 |
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Xaver Schloegel +1 more | 2024-05-28 |
| 11879966 | Transmission of wireless signal having information on a local oscillator signal | Josef Boeck, Rudolf Lachner, Walter Hartner | 2024-01-23 |
| 11872853 | Selective activation of tire pressure monitoring system (TPMS) sensor modules for radio-frequency (RF) communication using directional RF beams | Michael Kandler, Thomas Engl, Tuncay ERDOEL, Maximilian Werner | 2024-01-16 |
| 11824019 | Chip package with substrate integrated waveguide and waveguide interface | Tuncay ERDOEL, Walter Hartner, Ulrich Moeller, Bernhard Rieder, Ernst Seler | 2023-11-21 |
| 11658135 | Semiconductor devices comprising a radar semiconductor chip and associated production methods | Ernst Seler, Markus Lang | 2023-05-23 |
| 11539291 | Method of manufacturing a power semiconductor system | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Xaver Schloegel +1 more | 2022-12-27 |
| 11387533 | Semiconductor package with plastic waveguide | Dirk Hammerschmidt, Walter Hartner, Johannes Lodermeyer, Chiara Mariotti, Thorsten Meyer | 2022-07-12 |
| 11355838 | Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave | Ashutosh Baheti, Marwa Abdel-Aziz, Mustafa Doga Dogan, Muhammad Tayyab Qureshi, Saverio Trotta | 2022-06-07 |
| 11251146 | Semiconductor devices having a non-galvanic connection | Walter Hartner, Francesca Arcioni, Birgit Hebler, Martin Richard Niessner, Claus Waechter | 2022-02-15 |
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Claus Waechter, Veronika Huber, Dominic Maier +4 more | 2021-12-07 |
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Christian Geissler, Walter Hartner, Claus Waechter | 2021-10-12 |
| 10930541 | Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package | Thomas Kilger, Francesca Arcioni | 2021-02-23 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner +2 more | 2021-02-09 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Xaver Schloegel +1 more | 2020-11-10 |
| 10692824 | Radar module with wafer level package and underfill | Rudolf Lachner, Linus Maurer | 2020-06-23 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Xaver Schloegel +1 more | 2020-03-24 |
| 10217695 | Connector block with two sorts of through connections, and electronic device comprising a connector block | Thorsten Meyer, Klaus Pressel | 2019-02-26 |
| 10186481 | Semiconductor device including a passive component formed in a redistribution layer | Frank Daeche, Zeeshan Umar | 2019-01-22 |
| 10121751 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2018-11-06 |
| 9922946 | Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component | Ernst Seler, Walter Hartner, Josef Boeck | 2018-03-20 |
| 9910145 | Wireless communication system, a radar system and a method for determining a position information of an object | Josef Boeck, Rudolf Lachner, Walter Hartner | 2018-03-06 |
| 9653426 | Method of manufacturing a semiconductor package having an integrated microwave component | Ernst Seler, Walter Hartner, Josef Boeck | 2017-05-16 |