Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368111 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Walter Hartner, Christian Geissler, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer +1 more | 2025-07-22 |
| 11505450 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Robert Gruenberger, Bernhard Winkler | 2022-11-22 |
| 11251146 | Semiconductor devices having a non-galvanic connection | Walter Hartner, Francesca Arcioni, Birgit Hebler, Martin Richard Niessner, Maciej Wojnowski | 2022-02-15 |
| 11195787 | Semiconductor device including an antenna | Ngoc-Hoa Huynh, Franz-Xaver Muehlbauer, Veronika Huber, Dominic Maier, Thomas Kilger +4 more | 2021-12-07 |
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Christian Geissler, Walter Hartner, Maciej Wojnowski | 2021-10-12 |
| 11040872 | Semiconductor module | Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier | 2021-06-22 |
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Robert Gruenberger, Bernhard Winkler | 2021-01-26 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more | 2020-02-04 |
| 10435292 | Method for producing a semiconductor module | Edward Fuergut, Bernd Goller, Michael Ledutke, Dominic Maier | 2019-10-08 |