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Florian BRANDL

Infineon Technologies Ag: 9 patents #986 of 7,486Top 15%
AA Abb Technology Ag: 1 patents #541 of 1,391Top 40%
📍 Maxhütte-Haidhof, DE: #7 of 30 inventorsTop 25%
Overall (All Time): #476,157 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12195325 MEMS devices with support structures and associated production methods 2025-01-14
11505450 Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package Christian Geissler, Robert Gruenberger, Claus Waechter, Bernhard Winkler 2022-11-22
11247895 Segmented stress decoupling via frontside trenching Robert Gruenberger, Wolfram Langheinrich 2022-02-15
10996125 Pressure sensors and method for forming a MEMS pressure sensor Markus Eckinger, Dirk Hammerschmidt, Bernhard Winkler 2021-05-04
10899604 Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package Christian Geissler, Robert Gruenberger, Claus Waechter, Bernhard Winkler 2021-01-26
10858245 Deposition of protective material at wafer level in front end for early stage particle and moisture protection Manfred Fries, Franz-Peter Kalz 2020-12-08
10843916 Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling Dirk Meinhold, Robert Gruenberger, Wolfram Langheinrich, Sebastian Luber, Roland Meier +1 more 2020-11-24
10807862 Segmented stress decoupling via frontside trenching Robert Gruenberger, Wolfram Langheinrich 2020-10-20
10370244 Deposition of protective material at wafer level in front end for early stage particle and moisture protection Manfred Fries, Franz-Peter Kalz 2019-08-06
8552317 Metal-encapsulated, polyphase, gas-insulated busbar switch disconnector and earthing switch Daniel Zwicky, David Saxl, Michael Mann, Daniel Kuhl 2013-10-08