Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505450 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Claus Waechter, Bernhard Winkler | 2022-11-22 |
| 11247895 | Segmented stress decoupling via frontside trenching | Florian BRANDL, Wolfram Langheinrich | 2022-02-15 |
| 10899604 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Claus Waechter, Bernhard Winkler | 2021-01-26 |
| 10843916 | Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-filling | Dirk Meinhold, Florian BRANDL, Wolfram Langheinrich, Sebastian Luber, Roland Meier +1 more | 2020-11-24 |
| 10807862 | Segmented stress decoupling via frontside trenching | Florian BRANDL, Wolfram Langheinrich | 2020-10-20 |
| 8993394 | Micro-electromechanical system devices | Karlheinz Mueller, Bernhard Winkler | 2015-03-31 |
| 8318581 | Micro-electromechanical system devices | Karl-Heinz Mueller, Bernhard Winkler | 2012-11-27 |
| 8125046 | Micro-electromechanical system devices | Karl-Heinz Mueller, Bernhard Winkler | 2012-02-28 |
| 7889030 | Passive temperature compensation of silicon MEMS devices | Florian Schoen, Mohsin Nawaz, Bernhard Winkler | 2011-02-15 |