Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798874 | Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof | Walter Hartner, Tuncay ERDOEL, Vincenzo Fiore, Helmut Kollmann, Arif Roni +2 more | 2023-10-24 |
| 11251146 | Semiconductor devices having a non-galvanic connection | Walter Hartner, Birgit Hebler, Martin Richard Niessner, Claus Waechter, Maciej Wojnowski | 2022-02-15 |
| 10930541 | Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package | Thomas Kilger, Maciej Wojnowski | 2021-02-23 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Christian Geissler, Walter Hartner, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |
| 9577852 | Common-mode suppressor based on differential transmission line | Maciej Wojnowski, Alexander Glas, Hubert Werthmann, Josef-Paul Schaffer, Gabriele Bettineschi | 2017-02-21 |