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USPTO Patent Rankings Data through Dec 31, 2025
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Robert Fehler — 13 Patents

Infineon Technologies Ag: 7 patents #1,301 of 7,486Top 20%
IAInfineon Technologies Austria Ag: 6 patents #187 of 1,126Top 20%
Regensburg, DE: #173 of 1,384 inventorsTop 15%
Overall (All Time): #362,438 of 4,157,543Top 9%
13 Patents All Time
Robert Fehler has been granted 13 US patents while listed as an inventor at Infineon Technologies Ag. The first was granted in 2020 and the most recent in September 2025. Robert Fehler ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Robert Fehler in Regensburg, DE.

Patents per Year

Patents granted per year, 2020 to 2025Bar chart with a peak of 4 patents in 2024.peak 42020: 1 patents20202021: 1 patents20212022: 3 patents20222023: 2 patents20232024: 4 patents20242025: 2 patents2025

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12431367 Embedded package with shielding pad Angela Kessler, Kushal Kshirsagar, Emanuele Bodano, Martin Benisek 2025-09-30
12237246 Semiconductor devices including parallel electrically conductive layers Petteri Palm, Josef Hoeglauer, Angela Kessler 2025-02-25
12159829 Semiconductor package with non-uniformly distributed vias Sergey Yuferev, Petteri Palm 2024-12-03
12131988 Semiconductor package and passive element with interposer Angela Kessler, Robert Carroll 2024-10-29
12009290 Semiconductor module having a multi-branch switch node connector Sergey Yuferev, Angela Kessler, Gerhard Noebauer, Petteri Palm 2024-06-11
11935874 Circuitry and method of forming a circuitry Sergey Yuferev 2024-03-19
11848262 Semiconductor package and passive element with interposer Angela Kessler, Robert Carroll 2023-12-19
11664304 Semiconductor module Sergey Yuferev, Angela Kessler, Gerhard Noebauer, Petteri Palm 2023-05-30
11469164 Space efficient and low parasitic half bridge Eung San Cho, Danny Clavette, Petteri Palm 2022-10-11
11444017 Semiconductor package and method of manufacturing a semiconductor package Sergey Yuferev, Petteri Palm 2022-09-13
11348861 Semiconductor package and method of manufacturing a semiconductor package Sergey Yuferev, Petteri Palm 2022-05-31
10916484 Electronic device including redistribution layer pad having a void Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner, Thorsten Meyer +2 more 2021-02-09
10811342 Semiconductor package and method of manufacturing a semiconductor package Sergey Yuferev, Petteri Palm 2020-10-20

Frequent Collaborators

Petteri Palm8 shared
Sergey Yuferev7 shared
Angela Kessler6 shared
Gerhard Noebauer2 shared
Robert Carroll2 shared
Christian Geissler1 shared

Nearby-Ranked Inventors

Jianping Shen13
Eric John Telfeyan13
George R. Breiwa, III13
Thomas Sugar13
Andrew Howley13
Howard Halpern13
Po-Yuan Wang13
Douglas Vanesko13
Tanuj Trivedi13