Issued Patents All Time
Showing 1–25 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368111 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Christian Geissler, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer, Martin Richard Niessner +1 more | 2025-07-22 |
| 12107026 | Circuit arrangement with a thermal interface | Raphael Hellwig, Philip Michael AMOS | 2024-10-01 |
| 12094842 | Semiconductor device having an antenna arranged over an active main surface of a semiconductor die | Thorsten Meyer, Maciej Wojnowski | 2024-09-17 |
| 12040543 | Radio-frequency devices and methods for producing radio-frequency devices | Tuncay ERDOEL, Klaus Elian, Christian Geissler, Bernhard Rieder, Rainer Markus Schaller +2 more | 2024-07-16 |
| 11879966 | Transmission of wireless signal having information on a local oscillator signal | Josef Boeck, Rudolf Lachner, Maciej Wojnowski | 2024-01-23 |
| 11824019 | Chip package with substrate integrated waveguide and waveguide interface | Tuncay ERDOEL, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski | 2023-11-21 |
| 11798874 | Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof | Francesca Arcioni, Tuncay ERDOEL, Vincenzo Fiore, Helmut Kollmann, Arif Roni +2 more | 2023-10-24 |
| 11791529 | Radio-frequency devices and associated production methods | Bernhard Rieder | 2023-10-17 |
| 11764453 | RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture | Bernhard Rieder | 2023-09-19 |
| 11387533 | Semiconductor package with plastic waveguide | Maciej Wojnowski, Dirk Hammerschmidt, Johannes Lodermeyer, Chiara Mariotti, Thorsten Meyer | 2022-07-12 |
| 11251146 | Semiconductor devices having a non-galvanic connection | Francesca Arcioni, Birgit Hebler, Martin Richard Niessner, Claus Waechter, Maciej Wojnowski | 2022-02-15 |
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Christian Geissler, Claus Waechter, Maciej Wojnowski | 2021-10-12 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |
| 10607911 | Chip carrier laminate with high frequency dielectric and thermomechanical buffer | Martin Richard Niessner, Gerhard Haubner, Sebastian Pahlke | 2020-03-31 |
| 10008470 | Embedded chip packages and methods for manufacturing an embedded chip package | Gottfried Beer | 2018-06-26 |
| 9922946 | Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component | Ernst Seler, Maciej Wojnowski, Josef Boeck | 2018-03-20 |
| 9910145 | Wireless communication system, a radar system and a method for determining a position information of an object | Josef Boeck, Rudolf Lachner, Maciej Wojnowski | 2018-03-06 |
| 9721920 | Embedded chip packages and methods for manufacturing an embedded chip package | Gottfried Beer | 2017-08-01 |
| 9653426 | Method of manufacturing a semiconductor package having an integrated microwave component | Ernst Seler, Maciej Wojnowski, Josef Boeck | 2017-05-16 |
| 9583811 | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound | Ernst Seler, Maciej Wojnowski, Josef Boeck | 2017-02-28 |
| 9356332 | Integrated-circuit module with waveguide transition element | Ernst Seler, Maciej Wojnowski | 2016-05-31 |
| 9337159 | Semiconductor package with integrated microwave component | Ernst Seler, Maciej Wojnowski, Josef Boeck | 2016-05-10 |
| 9275895 | Semiconductor component and methods for producing a semiconductor component | Andreas Meiser, Hermann Gruber, Dietrich Bonart, Thomas R. Gross | 2016-03-01 |
| 8952521 | Semiconductor packages with integrated antenna and method of forming thereof | Maciej Wojnowski, Ottmar Geitner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi | 2015-02-10 |
| 8912087 | Method of fabricating a chip package | Josef Hirtreiter, Ulrich Wachter, Juergen Foerster | 2014-12-16 |