Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368111 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Walter Hartner, Christian Geissler, Thomas Kilger, Johannes Lodermeyer, Franz-Xaver Muehlbauer +1 more | 2025-07-22 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Thomas Bemmerl, Martin Gruber | 2024-01-02 |
| 11251146 | Semiconductor devices having a non-galvanic connection | Walter Hartner, Francesca Arcioni, Birgit Hebler, Claus Waechter, Maciej Wojnowski | 2022-02-15 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner +2 more | 2021-02-09 |
| 10607911 | Chip carrier laminate with high frequency dielectric and thermomechanical buffer | Walter Hartner, Gerhard Haubner, Sebastian Pahlke | 2020-03-31 |
| 10408919 | RF system with an RFIC and antenna system | Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh | 2019-09-10 |
| 10317512 | RF system with an RFIC and antenna system | Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh | 2019-06-11 |