Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393742 | Method for fabricating a semiconductor flip-chip package | Thorsten Meyer, Irmgard Escher-Poeppel, Bernd Rakow | 2022-07-19 |
| 10217695 | Connector block with two sorts of through connections, and electronic device comprising a connector block | Thorsten Meyer, Maciej Wojnowski | 2019-02-26 |
| 9601475 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl +1 more | 2017-03-21 |
| 9293423 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl +1 more | 2016-03-22 |
| 8952521 | Semiconductor packages with integrated antenna and method of forming thereof | Maciej Wojnowski, Walter Hartner, Ottmar Geitner, Gottfried Beer, Mehran Pour Mousavi | 2015-02-10 |
| 8779563 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Stephan Brandl, Ralf Plieninger, Jens Pohl +1 more | 2014-07-15 |
| 8779583 | Semiconductor device and manufacturing method | Gottfried Beer | 2014-07-15 |
| 8598709 | Method and system for routing electrical connections of semiconductor chips | Thorsten Meyer, Gottfried Beer, Christian Geissler, Thomas Ort, Bernd Waidhas +1 more | 2013-12-03 |
| 8338936 | Semiconductor device and manufacturing method | Gottfried Beer | 2012-12-25 |
| 8309454 | Structure for electrostatic discharge in embedded wafer level packages | Markus Brunnbauer, Thorsten Meyer, Stephan Bradl, Ralf Plieninger, Jens Pohl +1 more | 2012-11-13 |
| 8237259 | Embedded chip package | Gottfried Beer | 2012-08-07 |
| 7910404 | Method of manufacturing a stacked die module | Gottfried Beer | 2011-03-22 |
| 7863728 | Semiconductor module including components in plastic casing | Gottfried Beer, Christoph Kienmayer, Werner Simbuerger | 2011-01-04 |
| 7858440 | Stacked semiconductor chips | Gottfried Beer | 2010-12-28 |
| 7799659 | Singulating semiconductor wafers to form semiconductor chips | Adolf Koller, Horst Theuss | 2010-09-21 |
| 7692588 | Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof | Gottfried Beer, Christoph Kienmayer, Werner Simbuerger | 2010-04-06 |
| 7687895 | Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips | Markus Brunnbauer, Jens Pohl, Thorsten Meyer, Recai Sezi, Stephan Bradl +1 more | 2010-03-30 |
| 7659618 | Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device | Jochen Dangelmaier, Horst Theuss | 2010-02-09 |
| 7504711 | Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof | Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller | 2009-03-17 |
| 7268423 | Flexible rewiring plate for semiconductor components, and process for producing it | Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller | 2007-09-11 |