TO

Thomas Ort

IN Intel: 13 patents #3,143 of 30,777Top 15%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Overall (All Time): #335,254 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12362251 Fan out package with integrated peripheral devices and methods Lizabeth Keser, Bernd Waidhas, Thomas Wagner 2025-07-15
12057364 Package formation methods including coupling a molded routing layer to an integrated routing layer Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2024-08-06
11955395 Fan out package with integrated peripheral devices and methods Lizabeth Keser, Bernd Waidhas, Thomas Wagner 2024-04-09
11764187 Semiconductor packages, and methods for forming semiconductor packages Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin +2 more 2023-09-19
11508637 Fan out package and methods Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2022-11-22
11404339 Fan out package with integrated peripheral devices and methods Lizabeth Keser, Bernd Waidhas, Thomas Wagner 2022-08-02
11211337 Face-up fan-out electronic package with passive components using a support Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2021-12-28
10867934 Component magnetic shielding for microelectronic devices Saravana Maruthamuthu, Andreas Wolter, Andreas Augustin, Veronica Sciriha, Bernd Waidhas 2020-12-15
10720393 Molded substrate package in fan-out wafer level package Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2020-07-21
10699980 Fan out package with integrated peripheral devices and methods Lizabeth Keser, Bernd Waidhas, Thomas Wagner 2020-06-30
10665522 Package including an integrated routing layer and a molded routing layer Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2020-05-26
10546817 Face-up fan-out electronic package with passive components using a support Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2020-01-28
10403580 Molded substrate package in fan-out wafer level package Lizabeth Keser, Thomas Wagner, Bernd Waidhas 2019-09-03
8598709 Method and system for routing electrical connections of semiconductor chips Thorsten Meyer, Gottfried Beer, Christian Geissler, Klaus Pressel, Bernd Waidhas +1 more 2013-12-03