Thomas Ort — 15 Patents at Intel

Thomas Ort has been granted 15 US patents while listed as an inventor at Intel. The first was granted in 2013 and the most recent in December 2025. Thomas Ort ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Thomas Ort in Veitsbronn, DE.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12497940	Method of refurbishing an energy conversion facility and refurbished energy conversion facility	Veerandra Chakkaravarthy Andichamy, Rebecca Fuhrman, Kayli Rentzel	2025-12-16
12362251	Fan out package with integrated peripheral devices and methods	Lizabeth Keser, Bernd Waidhas, Thomas Wagner	2025-07-15
12057364	Package formation methods including coupling a molded routing layer to an integrated routing layer	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2024-08-06	$17,070,000
11955395	Fan out package with integrated peripheral devices and methods	Lizabeth Keser, Bernd Waidhas, Thomas Wagner	2024-04-09	$27,197,000
11764187	Semiconductor packages, and methods for forming semiconductor packages	Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin +2 more	2023-09-19	$20,015,000
11508637	Fan out package and methods	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2022-11-22	$12,862,000
11404339	Fan out package with integrated peripheral devices and methods	Lizabeth Keser, Bernd Waidhas, Thomas Wagner	2022-08-02	$13,520,000
11211337	Face-up fan-out electronic package with passive components using a support	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2021-12-28	$27,770,000
10867934	Component magnetic shielding for microelectronic devices	Saravana Maruthamuthu, Andreas Wolter, Andreas Augustin, Veronica Sciriha, Bernd Waidhas	2020-12-15
10720393	Molded substrate package in fan-out wafer level package	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2020-07-21
10699980	Fan out package with integrated peripheral devices and methods	Lizabeth Keser, Bernd Waidhas, Thomas Wagner	2020-06-30
10665522	Package including an integrated routing layer and a molded routing layer	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2020-05-26
10546817	Face-up fan-out electronic package with passive components using a support	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2020-01-28
10403580	Molded substrate package in fan-out wafer level package	Lizabeth Keser, Thomas Wagner, Bernd Waidhas	2019-09-03
8598709	Method and system for routing electrical connections of semiconductor chips	Thorsten Meyer, Gottfried Beer, Christian Geissler, Klaus Pressel, Bernd Waidhas +1 more	2013-12-03

Thomas Ort — 15 Patents

Issued Patents All Time

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