Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362251 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2025-07-15 |
| 12057364 | Package formation methods including coupling a molded routing layer to an integrated routing layer | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2024-08-06 |
| 11955395 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2024-04-09 |
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin +2 more | 2023-09-19 |
| 11508637 | Fan out package and methods | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2022-11-22 |
| 11404339 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2022-08-02 |
| 11211337 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2021-12-28 |
| 10867934 | Component magnetic shielding for microelectronic devices | Saravana Maruthamuthu, Andreas Wolter, Andreas Augustin, Veronica Sciriha, Bernd Waidhas | 2020-12-15 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-05-26 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2020-01-28 |
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2019-09-03 |
| 8598709 | Method and system for routing electrical connections of semiconductor chips | Thorsten Meyer, Gottfried Beer, Christian Geissler, Klaus Pressel, Bernd Waidhas +1 more | 2013-12-03 |