Issued Patents All Time
Showing 25 most recent of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406925 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2025-09-02 |
| 12341096 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2025-06-24 |
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Bernd Waidhas, Georg Seidemann, Thomas Wagner | 2024-10-22 |
| 11984246 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2024-05-14 |
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more | 2024-04-09 |
| 11784143 | Single metal cavity antenna in package connected to an integrated transceiver front-end | Sonja Koller, Kilian Roth, Josef Hagn, Andreas Augustin | 2023-10-10 |
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 |
| 11646498 | Package integrated cavity resonator antenna | Kilian Roth, Sonja Koller, Josef Hagn, Andreas Augustin | 2023-05-09 |
| 11521793 | Resonant LC tank package and method of manufacture | Saravana Maruthamuthu, Andreas Augustin | 2022-12-06 |
| 11469213 | Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics | Georg Seidemann, Thomas Wagner, Klaus Reingruber, Bernd Waidhas | 2022-10-11 |
| 11410908 | Integrated circuit devices with front-end metal structures | Reinhard Mahnkopf, Sonja Koller | 2022-08-09 |
| 11374323 | Patch antennas stitched to systems in packages and methods of assembling same | Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Stephan Stoeckl +2 more | 2022-06-28 |
| 11270941 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2022-03-08 |
| 11250981 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2022-02-15 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more | 2022-02-01 |
| 11177220 | Vertical and lateral interconnects between dies | Georg Seidemann, Bernd Waidhas, Thomas Wagner | 2021-11-16 |
| 11127813 | Semiconductor inductors | Georg Seidemann, Bernd Waidhas, Thomas Wagner, Andreas Augustin | 2021-09-21 |
| 11107763 | Interconnect structure for stacked die in a microelectronic device | Thomas Wagner, Georg Seidemann | 2021-08-31 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Reinhard Mahnkopf +2 more | 2021-05-25 |
| 10896780 | Resonant LC tank package and method of manufacture | Saravana Maruthamuthu, Andreas Augustin | 2021-01-19 |
| 10867934 | Component magnetic shielding for microelectronic devices | Saravana Maruthamuthu, Thomas Ort, Andreas Augustin, Veronica Sciriha, Bernd Waidhas | 2020-12-15 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2020-10-27 |
| 10784033 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2020-09-22 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Georg Seidemann, Thomas Wagner, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10535578 | Semiconductor devices, and a method for forming a semiconductor device | Reinhard Mahnkopf, Sonja Koller | 2020-01-14 |