| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Bernd Waidhas |
2025-09-02 |
|
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Bernd Waidhas |
2025-06-24 |
|
| 12125815 |
Assembly of 2XD module using high density interconnect bridges |
Bernd Waidhas, Georg Seidemann, Thomas Wagner |
2024-10-22 |
$18,859,000 |
| 11984246 |
Vertical inductor for WLCSP |
Thorsten Meyer, Gerhard Knoblinger |
2024-05-14 |
$33,809,000 |
| 11955462 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more |
2024-04-09 |
$27,197,000 |
| 11784143 |
Single metal cavity antenna in package connected to an integrated transceiver front-end |
Sonja Koller, Kilian Roth, Josef Hagn, Andreas Augustin |
2023-10-10 |
$20,947,000 |
| 11764187 |
Semiconductor packages, and methods for forming semiconductor packages |
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Andreas Augustin, Sonja Koller +2 more |
2023-09-19 |
$20,015,000 |
| 11646498 |
Package integrated cavity resonator antenna |
Kilian Roth, Sonja Koller, Josef Hagn, Andreas Augustin |
2023-05-09 |
$19,706,000 |
| 11521793 |
Resonant LC tank package and method of manufacture |
Saravana Maruthamuthu, Andreas Augustin |
2022-12-06 |
$14,727,000 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Georg Seidemann, Thomas Wagner, Klaus Reingruber, Bernd Waidhas |
2022-10-11 |
$16,542,000 |
| 11410908 |
Integrated circuit devices with front-end metal structures |
Reinhard Mahnkopf, Sonja Koller |
2022-08-09 |
$13,688,000 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Stephan Stoeckl +2 more |
2022-06-28 |
$15,065,000 |
| 11270941 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Bernd Waidhas |
2022-03-08 |
$16,017,000 |
| 11250981 |
Vertical inductor for WLCSP |
Thorsten Meyer, Gerhard Knoblinger |
2022-02-15 |
$14,138,000 |
| 11239199 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more |
2022-02-01 |
$16,992,000 |
| 11177220 |
Vertical and lateral interconnects between dies |
Georg Seidemann, Bernd Waidhas, Thomas Wagner |
2021-11-16 |
$23,453,000 |
| 11127813 |
Semiconductor inductors |
Georg Seidemann, Bernd Waidhas, Thomas Wagner, Andreas Augustin |
2021-09-21 |
$30,488,000 |
| 11107763 |
Interconnect structure for stacked die in a microelectronic device |
Thomas Wagner, Georg Seidemann |
2021-08-31 |
$22,590,000 |
| 11018114 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Reinhard Mahnkopf +2 more |
2021-05-25 |
|
| 10896780 |
Resonant LC tank package and method of manufacture |
Saravana Maruthamuthu, Andreas Augustin |
2021-01-19 |
|
| 10867934 |
Component magnetic shielding for microelectronic devices |
Saravana Maruthamuthu, Thomas Ort, Andreas Augustin, Veronica Sciriha, Bernd Waidhas |
2020-12-15 |
|
| 10816742 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more |
2020-10-27 |
|
| 10784033 |
Vertical inductor for WLCSP |
Thorsten Meyer, Gerhard Knoblinger |
2020-09-22 |
|
| 10727197 |
Embedded-bridge substrate connectors and methods of assembling same |
Bernd Waidhas, Georg Seidemann, Thomas Wagner, Stephan Stoeckl, Laurent Millou |
2020-07-28 |
|
| 10535578 |
Semiconductor devices, and a method for forming a semiconductor device |
Reinhard Mahnkopf, Sonja Koller |
2020-01-14 |
|
