| 12057411 |
Stress relief die implementation |
Wolfgang Molzer, Georg Seidemann, Bernd Waidhas |
2024-08-06 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Andreas Wolter +2 more |
2022-06-28 |
| 11018114 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more |
2021-05-25 |
| 10727197 |
Embedded-bridge substrate connectors and methods of assembling same |
Bernd Waidhas, Georg Seidemann, Andreas Wolter, Thomas Wagner, Laurent Millou |
2020-07-28 |
| 10403602 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more |
2019-09-03 |
| 10141265 |
Bent-bridge semiconductive apparatus |
Bernd Waidhas, Andreas Wolter, Reinhard Mahnkopf, Georg Seidemann, Thomas Wagner +1 more |
2018-11-27 |
| 9368461 |
Contact pads for integrated circuit packages |
Sven Albers, Georg Seidemann, Sonja Koller, Shubhada H. Sahasrabudhe, Sandeep B. Sane |
2016-06-14 |
| 7709936 |
Module with carrier element |
Michael Bauer |
2010-05-04 |
| 7602614 |
Electronic module and method for the production thereof |
Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel |
2009-10-13 |
| 6940156 |
Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module |
Michael Bauer, Christian Birzer, Gerald Ofner |
2005-09-06 |
