Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057411 | Stress relief die implementation | Wolfgang Molzer, Georg Seidemann, Bernd Waidhas | 2024-08-06 |
| 11374323 | Patch antennas stitched to systems in packages and methods of assembling same | Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Andreas Wolter +2 more | 2022-06-28 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more | 2021-05-25 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Georg Seidemann, Andreas Wolter, Thomas Wagner, Laurent Millou | 2020-07-28 |
| 10403602 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more | 2019-09-03 |
| 10141265 | Bent-bridge semiconductive apparatus | Bernd Waidhas, Andreas Wolter, Reinhard Mahnkopf, Georg Seidemann, Thomas Wagner +1 more | 2018-11-27 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Sonja Koller, Shubhada H. Sahasrabudhe, Sandeep B. Sane | 2016-06-14 |
| 7709936 | Module with carrier element | Michael Bauer | 2010-05-04 |
| 7602614 | Electronic module and method for the production thereof | Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel | 2009-10-13 |
| 6940156 | Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module | Michael Bauer, Christian Birzer, Gerald Ofner | 2005-09-06 |