| 12355492 |
Spectrally interleaved optical transceivers |
Kuang Liu, Binoy Shah, Jessie C. Rosenberg, Nikhil Kumar, Anthony Kopa +6 more |
2025-07-08 |
|
| 12347783 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2025-07-01 |
|
| 12038858 |
Processor package with universal optical input/output |
Anshuman Thakur, Dheeraj Subareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Mahesh Kumashikar |
2024-07-16 |
$26,089,000 |
| 11983135 |
Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge |
Dheeraj Subbareddy, Ankireddy Nalamalpu, Anshuman Thakur, MD Altaf Hossain, Mahesh Kumashikar +3 more |
2024-05-14 |
$33,809,000 |
| 11901299 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2024-02-13 |
$18,546,000 |
| 11824013 |
Package substrate with reduced interconnect stress |
Lauren A. Link, Andrew J. Brown, Sheng Li |
2023-11-21 |
$28,968,000 |
| 11557541 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2023-01-17 |
$13,997,000 |
| 11417592 |
Methods of utilizing low temperature solder assisted mounting techniques for package structures |
Omkar G. Karhade, Nachiket R. Raravikar |
2022-08-16 |
$17,788,000 |
| 11276625 |
Methods of forming flexure based cooling solutions for package structures |
Siddarth Kumar, Shubhada H. Sahasrabudhe, Shalabh Tandon |
2022-03-15 |
$18,336,000 |
| 10811366 |
Microelectronic bond pads having integrated spring structures |
Feras Eid, Robert L. Sankman |
2020-10-20 |
$43,271,000 |
| 10531575 |
Systems and methods for replaceable bail grid array (BGA) packages on board substrates |
Timothy Swettlen |
2020-01-07 |
$22,293,000 |
| 10325860 |
Microelectronic bond pads having integrated spring structures |
Feras Eid, Robert L. Sankman |
2019-06-18 |
$21,210,000 |
| 9953934 |
Warpage controlled package and method for same |
Siddarth Kumar, Shubhada H. Sahasrabudhe, Shalabh Tandon |
2018-04-24 |
$19,097,000 |
| 9659899 |
Die warpage control for thin die assembly |
Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more |
2017-05-23 |
$7,972,000 |
| 9659908 |
Systems and methods for package on package through mold interconnects |
Shubhada H. Sahasrabudhe, Siddarth Kumar, Shalabh Tandon |
2017-05-23 |
$7,972,000 |
| 9394619 |
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby |
Rajen S. Sidhu, Mukul Renavikar |
2016-07-19 |
$7,217,000 |
| 9368461 |
Contact pads for integrated circuit packages |
Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe |
2016-06-14 |
$9,885,000 |
| 9123732 |
Die warpage control for thin die assembly |
Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more |
2015-09-01 |
$13,376,000 |
| 8941236 |
Using collapse limiter structures between elements to reduce solder bump bridging |
Ameya Limaye, Richard J. Harries |
2015-01-27 |
$21,987,000 |
| 8441809 |
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same |
Ravi Mahajan |
2013-05-14 |
$17,697,000 |
| 8324737 |
Modified chip attach process |
Biju Chandran |
2012-12-04 |
$14,359,000 |
| 8064224 |
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same |
Ravi Mahajan |
2011-11-22 |
$16,463,000 |
| 7901982 |
Modified chip attach process |
Biju Chandran |
2011-03-08 |
$15,954,000 |
| 7781260 |
Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby |
Nachiket R. Raravikar |
2010-08-24 |
$13,244,000 |
| 7579213 |
Modified chip attach process |
Biju Chandran |
2009-08-25 |
$20,594,000 |
