Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355492 | Spectrally interleaved optical transceivers | Kuang Liu, Binoy Shah, Jessie C. Rosenberg, Nikhil Kumar, Anthony Kopa +6 more | 2025-07-08 |
| 12347783 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2025-07-01 |
| 12038858 | Processor package with universal optical input/output | Anshuman Thakur, Dheeraj Subareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Mahesh Kumashikar | 2024-07-16 |
| 11983135 | Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge | Dheeraj Subbareddy, Ankireddy Nalamalpu, Anshuman Thakur, MD Altaf Hossain, Mahesh Kumashikar +3 more | 2024-05-14 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2024-02-13 |
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Andrew J. Brown, Sheng Li | 2023-11-21 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2023-01-17 |
| 11417592 | Methods of utilizing low temperature solder assisted mounting techniques for package structures | Omkar G. Karhade, Nachiket R. Raravikar | 2022-08-16 |
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Siddarth Kumar, Shubhada H. Sahasrabudhe, Shalabh Tandon | 2022-03-15 |
| 10811366 | Microelectronic bond pads having integrated spring structures | Feras Eid, Robert L. Sankman | 2020-10-20 |
| 10531575 | Systems and methods for replaceable bail grid array (BGA) packages on board substrates | Timothy Swettlen | 2020-01-07 |
| 10325860 | Microelectronic bond pads having integrated spring structures | Feras Eid, Robert L. Sankman | 2019-06-18 |
| 9953934 | Warpage controlled package and method for same | Siddarth Kumar, Shubhada H. Sahasrabudhe, Shalabh Tandon | 2018-04-24 |
| 9659899 | Die warpage control for thin die assembly | Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more | 2017-05-23 |
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Siddarth Kumar, Shalabh Tandon | 2017-05-23 |
| 9394619 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Rajen S. Sidhu, Mukul Renavikar | 2016-07-19 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe | 2016-06-14 |
| 9123732 | Die warpage control for thin die assembly | Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more | 2015-09-01 |
| 8941236 | Using collapse limiter structures between elements to reduce solder bump bridging | Ameya Limaye, Richard J. Harries | 2015-01-27 |
| 8441809 | Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same | Ravi Mahajan | 2013-05-14 |
| 8324737 | Modified chip attach process | Biju Chandran | 2012-12-04 |
| 8064224 | Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same | Ravi Mahajan | 2011-11-22 |
| 7901982 | Modified chip attach process | Biju Chandran | 2011-03-08 |
| 7781260 | Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby | Nachiket R. Raravikar | 2010-08-24 |
| 7579213 | Modified chip attach process | Biju Chandran | 2009-08-25 |