Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of utilizing low temperature solder assisted mounting techniques for package structures

Methods of utilizing low temperature solder assisted mounting techniques for package structures

US Patent 11417592 · Granted Aug 16, 2022

Estimated economic value: $17,788,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced bridge structure for a photonic integrated circuit2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Ultra-thin, hyper-density semiconductor packages2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR2025
On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real 2025
Undercut design with a bonded base cover for friendly assembly and effective the2025
Microelectronic structures including bridges2025