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Home › Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)

Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)

US Patent 12436413 · Granted Oct 7, 2025

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