Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7312527 | Low temperature phase change thermal interface material dam | Nitin A. Deshpande, Chia-Pin Chiu | 2007-12-25 |
| 7304391 | Modified chip attach process and apparatus | Biju Chandran | 2007-12-04 |
| 7166540 | Method for reducing assembly-induced stress in a semiconductor die | Nitin A. Deshpande | 2007-01-23 |
| 6919224 | Modified chip attach process and apparatus | Biju Chandran | 2005-07-19 |
| 6788859 | Laminate substrate containing fiber optic cables | Voya R. Markovich, Sanjeev Sathe | 2004-09-07 |