| 12366713 |
Heat dissipation structures for optical communication devices |
Omkar G. Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan |
2025-07-22 |
|
| 12327807 |
High density substrate routing in package |
Weng Hong Teh |
2025-06-10 |
|
| 12308299 |
TEC-embedded dummy die to cool the bottom die edge hotspot |
Zhimin Wan, Peng Li, Deepak Goyal |
2025-05-20 |
|
| 12293956 |
Boiling enhancement structures for immersion cooled electronic systems |
Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more |
2025-05-06 |
|
| 12191220 |
Hybrid interposer of glass and silicon to reduce thermal crosstalk |
Zhimin Wan, Chandra Mohan Jha, Je-Young Chang |
2025-01-07 |
|
| 12176676 |
Package designs to enable dual-sided cooling on a laser chip |
— |
2024-12-24 |
$17,261,000 |
| 12113026 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2024-10-08 |
$19,971,000 |
| 12107042 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan |
2024-10-01 |
$20,560,000 |
| 12099245 |
Completely encapsulated optical multi chip package |
Asako Toda, Xiaoqian Li, Yiqun Bai |
2024-09-24 |
$33,787,000 |
| 12094800 |
Thermally conductive slugs/active dies to improve cooling of stacked bottom dies |
Zhimin Wan, Jin Yang, Peng Li, Deepak Goyal |
2024-09-17 |
$19,251,000 |
| 12051667 |
High density substrate routing in package |
Weng Hong Teh |
2024-07-30 |
$27,313,000 |
| 12009321 |
Package system and package |
Zhen Zhou, Tae Young Yang, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth P. Foust +2 more |
2024-06-11 |
$21,221,000 |
| 11984396 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan |
2024-05-14 |
$33,809,000 |
| 11876053 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2024-01-16 |
$42,805,000 |
| 11854931 |
STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die |
Zhimin Wan, Peng Li, Shankar Devasenathipathy |
2023-12-26 |
$39,948,000 |
| 11837519 |
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk |
Zhimin Wan, Chandra Mohan Jha |
2023-12-05 |
$33,749,000 |
| 11824008 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2023-11-21 |
$28,968,000 |
| 11810884 |
High density substrate routing in package |
Weng Hong Teh |
2023-11-07 |
$22,371,000 |
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Chandra Mohan Jha, Je-Young Chang, Liwei Wang |
2023-06-06 |
$21,341,000 |
| 11652020 |
Thermal solutions for multi-package assemblies and methods for fabricating the same |
Robert L. Sankman |
2023-05-16 |
$11,130,000 |
| 11646244 |
Socket loading mechanism for passive or active socket and package cooling |
Steven A. Klein, Zhimin Wan, Shankar Devasenathipathy |
2023-05-09 |
$19,706,000 |
| 11581671 |
Integrated circuit package socket housing to enhance package cooling |
Zhimin Wan, Steven A. Klein, Shankar Devasenathipathy |
2023-02-14 |
$12,790,000 |
| 11579426 |
Dual collimating lens configuration for optical devices |
Anna M. Prakash |
2023-02-14 |
$12,790,000 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot, Feras Eid |
2023-01-10 |
$14,061,000 |
| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more |
2022-12-06 |
$14,727,000 |
