Issued Patents All Time
Showing 25 most recent of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366713 | Heat dissipation structures for optical communication devices | Omkar G. Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan | 2025-07-22 |
| 12327807 | High density substrate routing in package | Weng Hong Teh | 2025-06-10 |
| 12308299 | TEC-embedded dummy die to cool the bottom die edge hotspot | Zhimin Wan, Peng Li, Deepak Goyal | 2025-05-20 |
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Zhimin Wan, Chandra Mohan Jha, Je-Young Chang | 2025-01-07 |
| 12176676 | Package designs to enable dual-sided cooling on a laser chip | — | 2024-12-24 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 12107042 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 |
| 12099245 | Completely encapsulated optical multi chip package | Asako Toda, Xiaoqian Li, Yiqun Bai | 2024-09-24 |
| 12094800 | Thermally conductive slugs/active dies to improve cooling of stacked bottom dies | Zhimin Wan, Jin Yang, Peng Li, Deepak Goyal | 2024-09-17 |
| 12051667 | High density substrate routing in package | Weng Hong Teh | 2024-07-30 |
| 12009321 | Package system and package | Zhen Zhou, Tae Young Yang, Tolga Acikalin, Johanny Escobar Pelaez, Kenneth P. Foust +2 more | 2024-06-11 |
| 11984396 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Zhimin Wan, Peng Li, Shankar Devasenathipathy | 2023-12-26 |
| 11837519 | Heatsink cutout and insulating through silicon vias to cut thermal cross-talk | Zhimin Wan, Chandra Mohan Jha | 2023-12-05 |
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2023-11-21 |
| 11810884 | High density substrate routing in package | Weng Hong Teh | 2023-11-07 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Zhimin Wan, Chandra Mohan Jha, Je-Young Chang, Liwei Wang | 2023-06-06 |
| 11652020 | Thermal solutions for multi-package assemblies and methods for fabricating the same | Robert L. Sankman | 2023-05-16 |
| 11646244 | Socket loading mechanism for passive or active socket and package cooling | Steven A. Klein, Zhimin Wan, Shankar Devasenathipathy | 2023-05-09 |
| 11581671 | Integrated circuit package socket housing to enhance package cooling | Zhimin Wan, Steven A. Klein, Shankar Devasenathipathy | 2023-02-14 |
| 11579426 | Dual collimating lens configuration for optical devices | Anna M. Prakash | 2023-02-14 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Kelly Lofgreen, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot, Feras Eid | 2023-01-10 |
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more | 2022-12-06 |