Issued Patents All Time
Showing 26–50 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515248 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11515232 | Liquid cooling through conductive interconnect | Robert L. Sankman, Pooya Tadayon | 2022-11-29 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Zhimin Wan, Chandra Mohan Jha, Weihua Tang, Shankar Devasenathipathy | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11251150 | High density substrate routing in package | Weng Hong Teh | 2022-02-15 |
| 11156815 | Compound parabolic concentrator including protrusion | Anna M. Prakash, Amanuel M. Abebaw, Olga Gorbounova, Ching-Ping Janet Shen, Shan Zhong +1 more | 2021-10-26 |
| 11140770 | Printed circuit board assembly | — | 2021-10-05 |
| 10957656 | Integrated circuit packages with patterned protective material | Kyle Yazzie, Naga Sivakumar Yagnamurthy, Pramod Malatkar, Mohit Mamodia, Mark Gallina +3 more | 2021-03-23 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2021-02-16 |
| 10861815 | High density substrate routing in package | Weng Hong Teh | 2020-12-08 |
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2019-12-17 |
| 10438915 | High density substrate routing in package | Weng Hong Teh | 2019-10-08 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10320051 | Heat sink for 5G massive antenna array and methods of assembling same | — | 2019-06-11 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chuan Hu, Johanna M. Swan | 2019-04-09 |
| 10199346 | High density substrate routing in package | Weng Hong Teh | 2019-02-05 |
| 10049987 | Enhanced fiducial visibility and recognition | Kyle Yazzie | 2018-08-14 |
| 10008451 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2018-06-26 |
| 10008475 | Stacked-die including a die in a package substrate | — | 2018-06-26 |
| 9929119 | High density substrate routing in BBUL package | Weng Hong Teh | 2018-03-27 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan, Sujit Sharan | 2018-01-23 |
| 9741664 | High density substrate interconnect formed through inkjet printing | Kinya Ichikawa, Robert L. Sankman | 2017-08-22 |