Issued Patents All Time
Showing 25 most recent of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266623 | Substrate bonding method | Yunzhi LING, Siliang HE, Jianguo Ma, Yuhao Bi, Xingyu Liu +1 more | 2025-04-01 |
| 12184253 | Filter radio frequency module packaging structure and method for manufacturing same | Yingqiang YAN, Xun XIANG, Wei ZHENG, Zhitao CHEN, Zhikuan Chen | 2024-12-31 |
| 12112956 | Chip interconnection package structure and method | Yao-Chang Wang, Zibai Li, Yunzhi LING, Xun XIANG, Yinhua CUI +1 more | 2024-10-08 |
| 11869872 | Chip stack packaging structure and chip stack packaging method | Yao-Chang Wang, Yunzhi LING, Yinhua CUI, Zibai Li, Wei Zhao +1 more | 2024-01-09 |
| 11783168 | Network accuracy quantification method and system, device, electronic device and readable medium | Fanhui Meng, Han Li, Xinyang Wu, Yaolong Zhu | 2023-10-10 |
| 11784625 | Packaging method and package structure for filter chip | Yingqiang YAN, Zhitao CHEN | 2023-10-10 |
| 11769044 | Neural network mapping method and apparatus | Weihao ZHANG, Han Li, Yaolong Zhu | 2023-09-26 |
| 11710646 | Fan-out packaging method and fan-out packaging plate | Yingqiang YAN, Yuejin Guo, Yingjun Pi, Junjun Liu, Edward R. Prack | 2023-07-25 |
| 11609672 | Touch control substrate and preparation method thereof, touch control module and display device | Zibai Li, Yao-Chang Wang, Boqian Chen, Zhitao CHEN | 2023-03-21 |
| 11455108 | Method and device for controlling storage format of on-chip storage resource | Ruiqiang DING, Han Li, Feng-Chun Wang, Fanhui Meng, Yaolong Zhu | 2022-09-27 |
| 11335664 | Integrated circuit packaging method and integrated packaging circuit | Junjun Liu, Yuejin Guo, Edward R. Prack | 2022-05-17 |
| 11333327 | Spotlight lamp with snap-fit anti-glare ring | Yisheng Xiao, Zicai Ma, Zeyu Liu | 2022-05-17 |
| 11255492 | Heat dissipation structure for lamp and LED lamp | Yinfei Yu, Wangbosheng Wu | 2022-02-22 |
| 11183458 | Integrated circuit packaging structure and method | Junjun Liu, Yuejin Guo, Edward R. Prack | 2021-11-23 |
| 10930634 | Integrated circuit system and packaging method therefor | Junjun Liu, Yuejin Guo, Edward R. Prack | 2021-02-23 |
| 10867961 | Single layer low cost wafer level packaging for SFF SiP | Vijay K. Nair | 2020-12-15 |
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Junjun Liu, Yuejin Guo, Edward R. Prack | 2020-12-15 |
| 10847496 | Chip wiring method and structure | Junjun Liu | 2020-11-24 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Junjun Liu, Yuejin Guo, Edward R. Prack | 2020-04-07 |
| 10535634 | Multi-layer package | Vijay K. Nair, Thorsten Meyer | 2020-01-14 |
| 10468367 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2019-11-05 |
| 10381288 | Packaged semiconductor die and CTE-engineering die pair | — | 2019-08-13 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chia-Pin Chiu, Johanna M. Swan | 2019-04-09 |
| 10122089 | Magnetic nanocomposite materials and passive components formed therewith | Vijay K. Nair, Shawna M. Liff, Larry E. Mosley | 2018-11-06 |
| 10096535 | Packaged semiconductor die and CTE-engineering die pair | — | 2018-10-09 |