Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112956 | Chip interconnection package structure and method | Yao-Chang Wang, Yunzhi LING, Xun XIANG, Yinhua CUI, Chuan Hu +1 more | 2024-10-08 |
| 11869872 | Chip stack packaging structure and chip stack packaging method | Yao-Chang Wang, Yunzhi LING, Yinhua CUI, Chuan Hu, Wei Zhao +1 more | 2024-01-09 |
| 11609672 | Touch control substrate and preparation method thereof, touch control module and display device | Yao-Chang Wang, Chuan Hu, Boqian Chen, Zhitao CHEN | 2023-03-21 |