Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266623 | Substrate bonding method | Siliang HE, Jianguo Ma, Yuhao Bi, Xingyu Liu, Chuan Hu +1 more | 2025-04-01 |
| 12112956 | Chip interconnection package structure and method | Yao-Chang Wang, Zibai Li, Xun XIANG, Yinhua CUI, Chuan Hu +1 more | 2024-10-08 |
| 11869872 | Chip stack packaging structure and chip stack packaging method | Yao-Chang Wang, Yinhua CUI, Chuan Hu, Zibai Li, Wei Zhao +1 more | 2024-01-09 |