Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266623 | Substrate bonding method | Yunzhi LING, Siliang HE, Jianguo Ma, Xingyu Liu, Chuan Hu +1 more | 2025-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266623 | Substrate bonding method | Yunzhi LING, Siliang HE, Jianguo Ma, Xingyu Liu, Chuan Hu +1 more | 2025-04-01 |